Foundry 3D Packaging Engineer - TX, Austin, United States
Originally posted 18 September 2026 by the employer — open 0 days.
This role drives technology development of advanced 3D package architectures.
About the role
This role drives technology development of advanced 3D package architectures. The scope includes coordinating proof of concept on new technology and product bring-up to meet performance, cost, and schedule requirements.
What you'll do
- Drive and participate in defining FMEA, TV Design, DFM, and DFY.
- Manage DOE plan and execution for material selections and process window validation.
- Define quality and reliability tests including defect detection and FA methodology.
- Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions.
- Transfer new products into a high yielding, cost-effective, high-volume manufacturing environment.
- Enable development partners in the AMD Ecosystem to bring up new packaging technology/process from concept to NPI and prototyping to mass production.
What you'll need
- Proven track record and extensive knowledge and experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV and Hybrid Bonding.
- Hands-on approach to process bring up and development.
- Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.
Nice to have
- Fundamental knowledge and experience with BEOL process, TSV integration and Hybrid bonding process and defect metrology.
- Strong knowledge and experience in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR.
- Strong knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques.
- Experience in the industry with strong problem solving, organizational, interpersonal, and presentation skills.
This role has been open 0 days — well below the 58-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
70
|
Median days open
58 d
|
Median salary
$176k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (70 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 70 |
| Open roles in the wider Process, Fab & Equipment family | 56 | 9328 · 108 employers |
| Median days open | 0 d | 58 d (−58 d vs this employer) |
| Median salary (USD postings) | — | $176k |
Who's hiring in this category
- Micron Technology · 13 open roles · median 102 d
- Intel Corporation · 11 open roles · median 28 d
- GlobalFoundries · 10 open roles · median 88 d
- Applied Materials · 8 open roles · median 25 d
- Renesas Electronics · 5 open roles · median 64 d
- Lumilens · 4 open roles · median 43 d
How we counted: 70 open Process Integration (Advanced Packaging) roles from 20 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.