Failure Analysis Intern - Durham, NC, United States
Originally posted 19 October 2026 by the employer.
About the role
MACOM is seeking a Failure Analysis Intern in Durham, NC. The position focuses on failure analysis and characterization for GaN high electron mobility transistor (HEMT) devices on SiC and Silicon substrates.
What you'll do
- Perform electrical probe testing and curve tracing on semiconductor devices. - Conduct high-resolution optical microscopy inspections. - Utilize characterization techniques including acoustic microscopy, focused ion beam (FIB) cross sectioning, secondary electron microscopy (SEM), and scanning transmission electron microscopy (STEM). - Analyze data using statistical software such as JMP and the Microsoft Office Suite. - Present failure analysis findings and data verbally and in written reports.
What you'll need
- Current enrollment in a Master’s or Doctoral degree program in MSE, ECE, or a similar engineering discipline. - Familiarity with epitaxial growth of GaN high electron mobility transistor (HEMT) on SiC and Silicon substrates. - Prior experience with electrical probe testing/curve tracing and high-resolution optical microscopy. - Understanding of acoustic microscopy, focused ion beam (FIB) cross sectioning, secondary electron microscopy (SEM) inspection, and scanning transmission electron microscopy (STEM) analysis. - Experience with statistical analysis software such as JMP and Microsoft Office Suite.
Nice to have
- Familiarity with electronic device fabrication processing technology and device mask layout principles. - Direct experience in focused ion beam (FIB), secondary electron microscopy (SEM), scanning transmission electron microscopy (STEM), or acoustic microscopy. - Familiarity with principles and characterization of radio frequency transistor devices. - Ability to view .gds files in a layout editor. - Familiarity with epitaxial wafer characterization methods such as sheet resistance mapping and photoluminescence mapping.
This role has been open 0 days — well below the 47-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
216
|
Median days open
47 d
|
Median salary
$97k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | MACOM | All employers we track in this specialty (216 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 216 |
| Open roles in the wider Process, Fab & Equipment family | 90 | 10278 · 109 employers |
| Median days open | 0 d | 47 d (−47 d vs this employer) |
| Median salary (USD postings) | — | $97k |
Who's hiring in this category
- Micron Technology · 46 open roles · median 53 d
- GlobalFoundries · 16 open roles · median 36 d
- Infineon Technologies · 15 open roles · median 30 d
- Lam Research · 15 open roles · median 35 d
- Western Digital · 13 open roles · median 18 d
- STMicroelectronics · 10 open roles · median 42 d
How we counted: 216 open Failure Analysis Engineering (Failure Analysis) roles from 40 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.