Failure Analysis Engineer - Tempe, AZ, United States
Originally posted 28 October 2026 by the employer.
About the role
As a Failure Analysis Engineer at the Tempe Product Analysis Lab, you will perform electrical failure analysis and lead physical failure analysis involving customer returns, qualification failures, reliability testing, design debug, and technology development. The role supports a portfolio including CMOS image sensors, automotive products, analog and mixed-signal ICs, digital devices, and Silicon Carbide (SiC) technologies.
What you'll do
- Perform electrical and lead physical failure analysis investigations on customer returns and internally generated failures from qualification, reliability, design debug, manufacturing, and technology development activities. - Characterize failure modes using semiconductor parameter analyzers, oscilloscopes, logic analyzers, function generators, application boards, and automated test equipment. - Utilize fault localization techniques such as Photon Emission Microscopy (PEM), OBIRCH, Electro-Optical Frequency Mapping (EOFM), Electro-Optical Probing (EOP), microprobing, nanoprobing, and scan diagnosis. - Direct and interpret physical and materials characterization activities utilizing SEM, FIB, TEM, EDS, FTIR, X-ray, CT imaging, and sample preparation techniques. - Correlate electrical characterization, fault localization, physical analysis, and materials characterization results to determine root cause and prepare data-driven technical reports supporting 8D problem-solving activities. - Develop and implement new analytical methodologies, workflows, and laboratory capabilities while providing technical mentorship to engineers and technicians.
What you'll need
- Bachelor's degree or higher in Electrical Engineering, Materials Science, Physics, or a related engineering discipline (Electrical Engineering preferred). - 5+ years of semiconductor failure analysis, product analysis, or advanced materials characterization experience. - Strong understanding of electrical characterization, fault localization, and semiconductor failure mechanisms. - Experience with one or more advanced failure analysis techniques such as PEM, OBIRCH, EOP, EOFM, microprobing, nanoprobing, EBIC, EBAC, or scan diagnosis. - Ability to handle and manipulate very small semiconductor samples during laboratory and chemical processing operations. - Demonstrated ability to independently lead complex technical investigations and prepare technical reports.
This role has been open 0 days — well below the 47-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
216
|
Median days open
47 d
|
Median salary
$97k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (216 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 216 |
| Open roles in the wider Process, Fab & Equipment family | 251 | 10290 · 107 employers |
| Median days open | 47 d | 47 d (same as this employer) |
| Median salary (USD postings) | — | $97k |
Who's hiring in this category
- Micron Technology · 46 open roles · median 53 d
- GlobalFoundries · 16 open roles · median 36 d
- Infineon Technologies · 15 open roles · median 30 d
- Lam Research · 15 open roles · median 35 d
- Western Digital · 13 open roles · median 18 d
- STMicroelectronics · 10 open roles · median 42 d
How we counted: 216 open Failure Analysis Engineering (Failure Analysis) roles from 40 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.