(Epi) - Module Development Engineer - (PhD Intern) - Oregon, Hillsboro, United States
$120,898 - $120,902 USD yearly
Originally posted 6 October 2026 by the employer.
About the role
As a Module Engineering PhD Intern, you will contribute to the optimization and development of manufacturing processes for a specific module within semiconductor production. You will gain hands-on experience with materials and device characterization techniques, such as SEM and TEM.
What you'll do
- Support the development and implementation of semiconductor manufacturing processes for a specific module.
- Sustain and improve manufacturing equipment performance to ensure operational reliability and efficiency.
- Assist in troubleshooting equipment issues and performing qualification activities to meet production standards.
- Collaborate with engineering teams to enhance process control methodologies and achieve production goals.
- Apply statistical analysis and design experimental methodologies to improve process reliability and throughput.
- Contribute to continuous improvement initiatives for process control systems and methodologies.
What you'll need
- Ph.D. degree in progress in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or another STEM-related field.
- Knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques.
- Familiarity with statistical data analysis and experimental design methodologies.
- Experience in materials and physical device characterization techniques, such as SEM or TEM, gained through coursework, academic research, or hands-on training.
- Familiarity with process control techniques and methodologies.
Nice to have
- PhD student 3rd or 4th year.
- Experience with thin film deposition and characterization.
- Hands-on experience using and maintaining scientific equipment.
- Research experience, experimental and data analysis expertise.
- Semiconductor device research, development or characterization experience.
This role has been open 9 days — well below the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
953
|
Median days open
51 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (953 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 71 | 953 |
| Open roles in the wider Software, Firmware & Systems family | 201 | 6156 · 145 employers |
| Median days open | 34 d | 51 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation (this employer) · 68 open roles · median 34 d
- KLA Corporation · 64 open roles · median 44 d
- Teradyne · 56 open roles · median 28 d
- NVIDIA · 51 open roles · median 67 d
- Applied Materials · 49 open roles · median 64 d
- AMD · 47 open roles · median 48 d
How we counted: 953 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.
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