ENGR II, MANUFACTURING EQUIP; MFG - Seremban, Negeri Sembilan, Malaysia
Originally posted 8 October 2026 by the employer.
About the role
This role involves leading a team of shift technicians to ensure maximum equipment uptime and performing advanced troubleshooting across die bond, clip bond, reflow, and inspection lines within front-end assembly. You will focus on ASM/CANON equipment and front-end assembly processes.
What you'll do
- Lead, supervise, and mentor shift technicians to ensure adherence to maintenance schedules and production KPIs.
- Take ownership of chronic or escalated machine issues, conducting root cause analysis for permanent resolution.
- Oversee and execute corrective and preventive maintenance for die attach, clip bond, reflow, oven, and AOI equipment.
- Monitor and analyze Overall Equipment Effectiveness (OEE), equipment Uptime, and Production Time to maximize line efficiency.
- Reduce maintenance operational costs by optimizing spare parts inventory and implementing component-level repairs.
- Lead continuous improvement initiatives (such as Kaizen, 5S, and Lean Six Sigma projects) to reduce recurring equipment failure rates.
- Collaborate with process engineering teams to analyze defect data, minimizing material waste and scrap.
- Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials.
What you'll need
- Hands-on engineering experience with ASM/CANON equipment and front-end assembly processes.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Die Bonder equipment: ASM AD838, AD8312PLUS, DA D510, ALPHASAM.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Clip Bonder equipment: AD830CB, AD830PLUS, BESTEM-C310.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Reflow & Ovens equipment: RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System).
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Screen Printer equipment: ASM DEK.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Cleaning Systems equipment: CREST.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Automated Optical Inspection (AOI) equipment: PENTAMASTER AOI.
This role has been open 18 days — well below the 56-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
3883
|
Median days open
56 d
|
Median salary
$126k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (3883 roles · 84 employers) |
|---|---|---|
| Open roles in this specialty | 90 | 3883 |
| Open roles in the wider Process, Fab & Equipment family | 254 | 10125 · 107 employers |
| Median days open | 55 d | 56 d (−1 d vs this employer) |
| Median salary (USD postings) | — | $126k |
Who's hiring in this category
- Applied Materials · 644 open roles · median 56 d
- Lam Research · 571 open roles · median 39 d
- KLA Corporation · 292 open roles · median 67 d
- Micron Technology · 271 open roles · median 50 d
- ASML · 183 open roles · median 81 d
- ASM International · 157 open roles · median 84 d
How we counted: 3883 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 84 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.