Engineer Principal, Supplier Quality - Thailand - Pathumthani (Navanakorn), Thailand
Originally posted 5 October 2026 by the employer.
Drive supplier quality excellence for semiconductor commodities supporting MEMS and LCOS devices.
About the role
The major tasks involve improving the quality performance of suppliers supporting MEMS and LCOS devices.
What you'll do
- Manage supplier quality for MEMS and LCOS devices, wafers, components, assemblies, and related semiconductor materials.
- Lead supplier qualification, capability assessment, and ongoing performance monitoring.
- Conduct supplier process audits, product audits, and quality system assessments.
- Evaluate semiconductor manufacturing processes, including wafer fabrication, MEMS structure formation, bonding, wafer-level packaging, dicing, assembly, optical alignment, testing, and final inspection.
- Lead root-cause analysis and corrective actions for supplier-related issues using 8D, Fishbone, 5 Why, and DOE.
- Monitor supplier quality dashboard, including yield, DPPM, customer returns, corrective-action closure, process capability, and on-time delivery.
What you'll need
- Bachelor’s degree or above in Electrical Engineering, Semiconductor Engineering, Materials Science, Mechanical Engineering, Optics, or Physics.
- 10+ years of experience in semiconductor quality, supplier quality, wafer manufacturing, optical components, or advanced packaging.
- Experience working with semiconductor suppliers, wafer fabs, OSATs, MEMS manufacturers, optical component suppliers, or display-related suppliers.
- Strong knowledge of semiconductor manufacturing processes, quality systems, and supplier management practices.
- Hands-on experience with root-cause analysis, 8D, CAPA, SPC, MSA, FMEA, control plans, and process capability analysis.
- Ability to interpret engineering drawings, specifications, test data, process data, and reliability reports.
- Experience with supplier audits and process qualification.
Nice to have
- Experience with MEMS, LCOS cell, or related optical electro products.
- Knowledge of wafer-level packaging, flip-chip, wire bonding, die attach, optical alignment, and active/passive assembly.
- Experience with optical and electrical characterization, including wavelength response, uniformity, contrast ratio, switching performance, leakage current, image quality, and reliability testing.
- Familiarity with ISO 9001, IATF 16949, ISO 13485, JEDEC, IPC, or other relevant industry standards.
- Experience with statistical data analysis and quality tools such as Minitab, JMP, or equivalent software.
- Master’s degree in a relevant technical field.
This role has been open 1 day — well below the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
311
|
Median days open
60 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lumentum | All employers we track in this specialty (311 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 311 |
| Open roles in the wider Process, Fab & Equipment family | 99 | 9631 · 109 employers |
| Median days open | 30 d | 60 d (−30 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 52 open roles · median 117 d
- Micron Technology · 36 open roles · median 38 d
- Renesas Electronics · 21 open roles · median 36 d
- Infineon Technologies · 17 open roles · median 54 d
- onsemi · 15 open roles · median 27 d
- GlobalFoundries · 13 open roles · median 69 d
How we counted: 311 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.