Engineer, PDE PCS & MRDA - Fab 10A, Singapore
Originally posted 6 October 2026 by the employer.
About the role
This role is responsible for developing, qualifying, deploying, and sustaining advanced defect inspection and metrology solutions for New Product Introduction (NPI), HBM technology ramps, and High Volume Manufacturing (HVM) in Advanced Packaging and Conventional Packaging technologies.
What you'll do
- Develop, qualify, deploy, and sustain advanced defect inspection and metrology solutions.
- Drive inspection capability readiness, equipment performance improvement, and defectivity reduction.
- Manage advanced inspection and metrology platforms throughout package development and manufacturing.
- Lead tool installation, qualification (TIQ), release, and production readiness activities.
- Set up defect metrics, observation methods, and continuous advancement plans.
- Manage and improve MRDA data systems and engineering applications for Advanced Packaging and Conventional Packaging technologies.
What you'll need
- Bachelor's Degree or equivalent experience in Engineering (Electrical, Mechanical, Mechatronics, Materials, Chemical Engineering, or related field).
- Deep understanding of semiconductor equipment performance, process integration, and manufacturing operations.
- Experience driving equipment qualifications, technology transfers, and manufacturing ramp readiness.
- Strong supplier management and collaborator engagement skills.
- Demonstrated ability to influence technical strategy across multiple organizations and sites.
- Ability to bring to bear AI, analytics, and automation to drive manufacturing excellence and efficiency.
Skills: inspection technology, metrology, equipment qualification, defectivity engineering, advanced packaging
This role has been open 0 days — well below the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
311
|
Median days open
60 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (311 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 37 | 311 |
| Open roles in the wider Process, Fab & Equipment family | 1486 | 9631 · 109 employers |
| Median days open | 36 d | 60 d (−24 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: inspection technology, metrology, equipment qualification, defectivity engineering, advanced packaging
Who's hiring in this category
- KLA Corporation · 52 open roles · median 117 d
- Micron Technology (this employer) · 36 open roles · median 38 d
- Renesas Electronics · 21 open roles · median 36 d
- Infineon Technologies · 17 open roles · median 54 d
- onsemi · 15 open roles · median 27 d
- GlobalFoundries · 13 open roles · median 69 d
How we counted: 311 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.