DRAM Architect – Principal Engineer | MTS - TPG
Originally posted 17 August 2026 by the employer.
About the role
This role involves developing and optimizing DRAM performance, power efficiency, and cost through system-level solutions, tools, and methodologies. The focus is on architectural innovation for current and future generations of DRAM technologies, including LPDDR5/6, DDR5/6, and HBM3E/4.
What you'll do
- Develop system-level solutions, tools, and methodologies for DRAM performance, power efficiency, and cost optimization.
- Collaborate with multi-functional teams to ideate, evaluate, and implement DRAM and memory system solutions.
- Analyze system behavior and assess solution effectiveness to make data-driven optimizations.
- Drive architectural innovation for current and future generations of DRAM technologies.
- Communicate complex technical concepts and mentor team members.
What you'll need
- Proven experience in memory design and product engineering, memory specifications and operations, or memory system architecture and usage.
- Minimum of 7 years of experience in the memory or semiconductor industry.
- Strong understanding of DRAM architectures and system-level interactions.
- Ability to analyze complex technical problems and drive solutions.
- Bachelor’s degree in Electrical Engineering, Physics, Computer Engineering, or a related field, or equivalent experience.
Nice to have
- Experience with advanced memory technologies such as LPDDR5/6, DDR5/6, GDDR6/7, or HBM3E/4.
- Deep understanding of industry trends, system-level trade-offs, and emerging memory technologies.
Skills: DRAM architecture, memory system solutions, LPDDR5/6, DDR5/6, HBM3E/4
This role has been open 49 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: DRAM architecture, memory system solutions, LPDDR5/6, DDR5/6, HBM3E/4
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.