Director Product Management - HW Platforms

About the role

As a Director Product Management - HW Platforms on the Platform team, you will own the product strategy, roadmap, and business execution for platform programs within the DCNBG. This includes switch-based platforms such as Teralynx-based scale-out and scale-up systems, CPO/CPC integrated platforms, and reference system architectures targeting hyperscale AI data centers.

What you'll do

• Own the product roadmap for platform-level solutions, including switch-based systems, CPO/CPC integrated platforms, and hyperscale reference architectures.
• Drive Market Requirements Documents (MRDs) and Product Requirements Documents (PRDs) through Marvell's product lifecycle (MPLC) process from Proposal Approval through Plan of Record (POR) and production.
• Lead cross-functional alignment across engineering, PMO, sales, and marketing to keep platform programs on schedule, within budget, and aligned with customer commitments.
• Engage directly with hyperscale customers to capture infrastructure requirements and translate them into product strategies.
• Present business cases, program status, and competitive landscapes to executive leadership at POR Preview and WIP reviews, including CEO-level briefings.
• Define and track product financials, including IRR, lifetime revenue, and cost targets in collaboration with finance and engineering.

What you'll need

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• 10+ years of experience in product management, product marketing, or a related technical role in the semiconductor or networking industry.
• Deep understanding of data center networking architectures, including Ethernet switching, scale-out and scale-up fabrics, and AI/HPC infrastructure.
• Demonstrated experience driving products through a full product lifecycle from market requirements through production release.
• Experience building and presenting financial models, including IRR, revenue forecasts, and competitive pricing.
• Experience working directly with hyperscale or cloud customers on silicon or systems programs.

Nice to have

• Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• Experience with co-packaged optics (CPO), co-packaged copper (CPC), or advanced packaging technologies.
• Prior experience in a Platform or Systems-level product management role at a semiconductor company.
• Familiarity with open networking software stacks (SONiC, SAI, OpenConfig) and their role in AI data center deployments.

Skills: product management, PRD, MRD, product roadmap, hyperscale, Ethernet switching

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