Director of Advanced Packaging Process Engineering - Kissimmee, FL 34744, United States
Originally posted 16 July 2026 by the employer.
About the role
The Process Engineering Director oversees process optimization across manufacturing operations to maintain efficiency, high yields, and low cost. The role leads engineering teams and collaborates with Advanced Technology Services and Advanced Packaging Development teams to introduce new manufacturing processes and capabilities.
What you'll do
- Lead, coach, and develop Process Engineering leaders and engineering teams to build execution capability and accountability. - Define and deploy Key Performance Indices (KPIs) and Objectives and Key Results (OKRs) to achieve operational and enterprise objectives. - Drive structured problem-solving methodologies to achieve effective Root Cause Corrective Action across operations. - Collaborate with Advanced Technology Services and Advanced Packaging Development teams to establish new manufacturing processes. - Monitor technology developments in process control, factory automation, and process development to implement relevant manufacturing capabilities.
What you'll need
- B.S. or M.S. degree in Mechanical, Electrical, or Chemical Engineering, Materials Science, Physics, or another relevant engineering discipline. - Minimum of 10 years of semiconductor technology development, advanced packaging, and/or process integration experience. - Minimum of 5 years of management experience leading technical teams. - Proven track record of transitioning technology from R&D to high-volume manufacturing (HVM). - Technical knowledge of semiconductor manufacturing processes (Litho, Etch, Deposition, CMP) and/or advanced packaging technologies and formats (FOWLP, FCBGA, SiP, RDL, 3DIC, HBM). - Experience applying structured problem-solving methodologies, Design of Experiments (DOE), and automated fault detection and control systems (FDC). - US Citizenship with the ability to obtain a US government security clearance.
Nice to have
- MBA degree. - Direct experience with advanced packaging formats including FOWLP, TSV, and bonding. - Knowledge of statistical process control (SPC).
This role has been open 99 days — well above the 61-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
86
|
Median days open
61 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SkyWater Technology | All employers we track in this specialty (86 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 86 |
| Open roles in the wider Process, Fab & Equipment family | 86 | 10073 · 106 employers |
| Median days open | 2 d | 61 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 37 d
- SkyWater Technology (this employer) · 12 open roles · median 2 d
- GlobalFoundries · 11 open roles · median 122 d
- Applied Materials · 8 open roles · median 36 d
- Intel Corporation · 8 open roles · median 83 d
- Renesas Electronics · 7 open roles · median 38 d
How we counted: 86 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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