Design Engineer - Chandler, AZ, United States
Originally posted 24 September 2026 by the employer.
Design PAs, LNAs, switches, and filters for highly compact multi-chip modules (MCM).
About the role
This role involves module-level design, modeling, and integration of PAs, LNAs, switches, and filters into multi-chip modules (MCM). The focus includes microwave/RF Front-End circuit design and integration of module dies into transmit/receive RF front-end modules (FEMs).
What you'll do
- Perform module-level design, modeling, and integration of PAs, LNAs, switches, and filters into MCMs.
- Design microwave/RF Front-End circuits including PA or LNA design details (DC bias, Bias Tee, Stability, impedance matching).
- Integrate module dies such as amplifiers, switches, and attenuators into single or multichip air-cavity or over-mold transmit/receive RF front-end modules (FEMs).
- Use RF CAD tools (ADS and/or Cadence Simulation and Layout) and EM simulators (ADS Momentum, ADS FEM, Ansys HFSS) for circuit performance prediction.
- Support full module simulation and develop laminate-based modules using Electromagnetic (EM) Simulation tools ADS FEM/Ansys HFSS.
- Characterize, verify, and debug designs through lab measurements with data analysis and programming tools like Spotfire and Excel.
What you'll need
- Bachelor’s degree in Electrical Engineering with a Radio Frequency focus and 3 years of work experience.
- Knowledge or understanding of microwave/RF Front-End circuit design (PA or LNA design details: DC bias, Bias Tee, Stability, impedance matching) and RF testing.
- Experience integrating module dies (amplifiers, switches, attenuators) in single or multichip air-cavity or over-mold transmit/receive RF front-end modules (FEMs).
- Experience with RF CAD tools (ADS and/or Cadence Simulation and Layout) and EM simulators (ADS Momentum, ADS FEM, Ansys HFSS) in conjunction with circuit simulators.
- Experience with Electromagnetic (EM) Simulation tools ADS FEM/Ansys HFSS to develop laminate-based modules.
- Experience supporting Full Module Simulation.
Skills: RF Front-End, PA, LNA, MMIC, ADS, HFSS
This role has been open 0 days — well below the 45-day median for RF/Wireless Engineering roles.
RF/Wireless Engineering · RF Frontend
|
Open roles in category
266
|
Median days open
45 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (266 roles · 35 employers) |
|---|---|---|
| Open roles in this specialty | 46 | 266 |
| Open roles in the wider Analog & Mixed-Signal family | 72 | 1355 · 107 employers |
| Median days open | 36 d | 45 d (−9 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: RF Front-End, PA, LNA, MMIC, ADS, HFSS
Who's hiring in this category
- QORVO (this employer) · 46 open roles · median 37 d
- Skyworks · 41 open roles · median 31 d
- Qualcomm · 26 open roles · median 63 d
- Apple · 23 open roles · median 16 d
- Keysight Technologies · 23 open roles · median 177 d
- Analog Devices · 13 open roles · median 41 d
How we counted: 266 open RF/Wireless Engineering (RF Frontend) roles from 35 employers tracked in the SemiconductorJobs index, counted 25 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Analog & Mixed-Signal family row. Figures refresh nightly.