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Broadcom

Chemical Mechanical Planarization (CMP) Process Engineer - USA-Colorado-Fort Collins-4380 Ziegler Road, United States

Broadcom USA-Colorado-Fort Collins-4380 Ziegler Road, United States Full-time 11 days ago
Digital Design & SoC Architecture

$91,100 USD yearly

Originally posted 5 October 2026 by the employer.

This role focuses on developing, optimizing, and ensuring the quality of CMP processes within the wafer fabrication facility.

About the role

As a CMP Process Engineer in the Finish Team, you will be responsible for developing, optimizing, and ensuring the quality of CMP processes within the wafer fabrication facility located in Fort Collins, Colorado.

What you'll do

  • Sustain daily CMP operations by monitoring statistical process control (SPC) charts and responding to lot holds, tool issues, and fault detection & classification (FDC) interdiction events.
  • Investigate and correct manufacturing defects, scrap, and other issues using root-cause analysis within a Plan-Do-Check-Act (PDCA) system.
  • Develop, characterize, and optimize processes to enable new product introduction (NPI), support new technology from R&D teams, increase wafer yield, and improve device performance.
  • Qualify new tools and recipes through the design and execution of rigorous process qualification plans while evaluating the impact on cost, throughput, capacity, and other factors.
  • Collaborate with integration, yield, procurement, and other teams to implement continuous improvement projects within the area of ownership.
  • Document procedures for Operators and other tool users to enable their operation of the equipment for the desired outcomes.

What you'll need

  • B.S. in Chemical Engineering, Mechanical Engineering, or related field.
  • 5 years of experience working in semiconductor manufacturing.
  • Experience maintaining an established process, monitoring inline data, and responding proactively to issues affecting Yield and/or Quality.
  • Design of Experiment (DOE), characterization, and optimization capabilities.
  • Strong understanding of SPC and proficiency with data science and SPC software (JMP, Spotfire, SPACE, Excel, etc).
  • Familiarity applying Lean manufacturing, Six-Sigma, and similar principles to complex issues.
Market context

This role has been open 10 days — well below the 51-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
953
Median days open
51 d
Median salary
$156k
See the full market breakdown ▾Category comparison, and who else is hiring
How Broadcom compares in Hardware Systems Engineering hiring
Metric Broadcom All employers we track in this specialty (953 roles · 102 employers)
Open roles in this specialty 15 953
Open roles in the wider Software, Firmware & Systems family 79 6156 · 145 employers
Median days open 24 d 51 d (−27 d vs this employer)
Median salary (USD postings) — $156k

Who's hiring in this category

  • Intel Corporation · 68 open roles · median 34 d
  • KLA Corporation · 64 open roles · median 44 d
  • Teradyne · 56 open roles · median 28 d
  • NVIDIA · 51 open roles · median 67 d
  • Applied Materials · 49 open roles · median 64 d
  • AMD · 47 open roles · median 48 d

How we counted: 953 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
USA-Colorado-Fort Collins-4380 Ziegler Road, United States
On-site
Full-time
$91,100 USD yearly
11 days ago

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