Packaging & Advanced Integration
Product & Program Management
Originally posted July 21, 2026 by the employer.
About the role
This role involves leading Wolfspeed's entry and growth in the advanced packaging market across emerging platforms including AI, high-performance computing (HPC), co-packaged optics (CPO), and silicon photonics.
What you'll do
- Identify and develop new business opportunities for SiC in advanced packaging applications across high-growth markets.
- Build executive-level relationships with AI chip designers, foundries, OSATs, EDA players, and photonics suppliers.
- Drive co-development programs and PDK-led engagements that embed SiC into customer packaging design flows.
- Lead strategic contracts, licensing, and partnership negotiations.
- Work closely with materials, technology development, and applications engineering teams to align growth initiatives.
- Monitor competitor activities, foundry roadmaps, and AI hardware trends to shape business development strategy.
What you'll need
- Bachelor's degree in Electrical Engineering, Materials Science, or related technical field.
- 10+ years of experience in business development, strategic partnerships, or sales within advanced semiconductor packaging, materials, or the semiconductor supply chain.
- Strong understanding of advanced packaging architectures (2.5D/3D, CoWoS, EMIB, Foveros, chiplet integration) and interconnect technologies (TSV, TSiCV, RDL, hybrid bonding).
- Ability to communicate SiC's technical value proposition to engineering and executive audiences at foundries, OSATs, and chip designers.
- Proven track record in securing strategic deals, joint development programs, or long-term supply agreements with global semiconductor customers.
- Willingness to travel globally.
Skills: market expansion, new business opportunities, advanced packaging architectures, ecosystem partnerships, strategic deals, product marketing
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