Backend Process Engineer - USA - Alhambra, CA, United States
$100,000 - $135,000 USD yearly
Originally posted 18 March 2026 by the employer.
Support backend wafer fabrication for Indium Phosphide (InP)–based photonic devices including DFB lasers and SOAs.
About the role
The Backend Process Engineer is responsible for the development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA), and automated optical inspection (AOI).
What you'll do
- Own and optimize backend wafer fab processes including lapping/thinning, n-side metallization, and RTA while establishing robust process windows, recipes, and control limits. - Own and maintain AOI processes for backend defect detection, inline data analysis, root-cause investigations, and yield monitoring. - Support cleaving, dicing, and singulation processes to maintain device integrity, alongside AR/HR optical coatings and vendor qualifications. - Collaborate with packaging, device, and reliability teams to evaluate backend process risks for new designs, materials, and device structures during NPI. - Author and maintain SOPs, travelers, process specifications, and control plans, establishing SPC metrics for backend processes.
What you'll need
- Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field. - Minimum of 3+ years of experience in backend semiconductor processing. - Hands-on experience with lapping/thinning, metallization, and thermal processes. - Understanding of InP-based or III-V compound semiconductor wafer fabrication processes. - Experience with AOI systems, yield analysis, and data-driven process improvement. - Proficiency in SPC, DOE, and statistical analysis.
Nice to have
- Experience with InP or III-V optoelectronic devices. - Familiarity with AR/HR optical coating processes. - Experience supporting high-mix, low-volume manufacturing environments.
Skills: backend wafer fab, lapping, thinning, metallization, RTA, InP-based, III-V compound semiconductor
This role has been open 216 days — well above the 72-day median for Process Engineering roles.
Process Engineering · Semiconductor Process
|
Open roles in category
1052
|
Median days open
72 d
|
Median salary
$137k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Semtech | All employers we track in this specialty (1052 roles · 56 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 1052 |
| Open roles in the wider Process, Fab & Equipment family | 22 | 10096 · 107 employers |
| Median days open | 142 d | 72 d (+70 d vs this employer) |
| Median salary (USD postings) | — | $137k |
Skills observed across this category: backend wafer fab, lapping, thinning, metallization, RTA, InP-based
Who's hiring in this category
- Micron Technology · 334 open roles · median 132 d
- GlobalFoundries · 88 open roles · median 89 d
- Applied Materials · 79 open roles · median 72 d
- Texas Instruments · 57 open roles · median 55 d
- STMicroelectronics · 50 open roles · median 48 d
- Entegris · 43 open roles · median 44 d
How we counted: 1052 open Process Engineering (Semiconductor Process) roles from 56 employers tracked in the SemiconductorJobs index, counted 26 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.