AutoTEM technician - Oregon, Hillsboro, United States
$63,090 - $89,060 USD yearly
Originally posted 18 September 2026 by the employer. Relisted by the employer on 5 October 2026.
About the role
As a Lab Engineering Technician, you will prepare ultra-thin specimens and conduct TEM (Transmission Electron Microscopy) analysis to support process/product development, qualification, and failure analysis within an electron microscopy lab. This position is critical to ensuring high-quality materials characterization.
What you'll do
- Perform advanced TEM sample preparation using dual-beam Focused Ion Beam (FIB) tools.
- Conduct imaging and analysis using TEM tools for characterization, process qualification, and failure analysis.
- Execute engineering tasks and technical procedures such as fabrication, technology development, and process integration.
- Maintain detailed records, analyze data, and present findings in compliance with lab procedures.
- Troubleshoot non-standard problems and deliver solutions.
- Sustain and maintain lab tools, ensuring precision and readiness for analytical tasks.
What you'll need
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Electronics Technology, or Material Science with 0-3 years of hands-on experience in lab or manufacturing settings, OR an Associate's degree in a related technical field with 6-8 years of relevant experience.
- Technical certification in fields related to lab operations or manufacturing.
- Proficiency in using advanced electron microscopy equipment, including FIB and TEM tools.
Nice to have
- Experience in military-relevant technical roles or comparable lab environments.
- Familiarity with semiconductor manufacturing processes and tools.
Skills: TEM, FIB, electron microscopy, materials characterization, failure analysis
This role has been open 17 days — well below the 47-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
189
|
Median days open
47 d
|
Median salary
$106k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (189 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 189 |
| Open roles in the wider Process, Fab & Equipment family | 168 | 9631 · 109 employers |
| Median days open | 52 d | 47 d (+5 d vs this employer) |
| Median salary (USD postings) | — | $106k |
Skills observed across this category: TEM, FIB, electron microscopy, materials characterization, failure analysis
Who's hiring in this category
- Micron Technology · 34 open roles · median 68 d
- Lam Research · 14 open roles · median 41 d
- Infineon Technologies · 13 open roles · median 41 d
- GlobalFoundries · 12 open roles · median 14 d
- AMD · 11 open roles · median 68 d
- Intel Corporation (this employer) · 11 open roles · median 52 d
How we counted: 189 open Failure Analysis Engineering (Failure Analysis) roles from 40 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.