ATD MIHL Equipment Development Engineer - Arizona, Phoenix, United States
$115,110 - $162,500 USD yearly
Originally posted 9 September 2026 by the employer — open 12 days.
About the role
This role involves designing and optimizing processes and equipment to support Intel's roadmap for packaging solutions.
What you'll do
- Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
- Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications.
- Design and maintain equipment to evaluate packaging technologies under simulated field conditions.
- Ensure manufacturability of physical layouts in package design and oversee manufacturing workflows.
- Define material specifications and collaborate with supplier quality and procurement teams.
- Innovate techniques, tools, and quality screens to identify and mitigate packaging reliability challenges.
What you'll need
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience, OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience, OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ months of relevant experience.
- Proficiency in Statistical Process Control (SPC).
- Proficiency in Design of Experiments (DOE) principles.
- Familiarity with mechanical drawings.
- Familiarity with Geometric Dimensioning and Tolerancing.
- Competency in mechanical design software such as SolidWorks or AutoCAD.
Nice to have
- Understanding of semiconductor fabrication processes.
- Understanding of packaging technologies.
- Familiarity with supply chain management in a manufacturing or materials qualification environment.
- Experience with high-precision manufacturing methods, including stamping.
- Experience with high-precision manufacturing methods, including CNC machining.
Skills: packaging technologies, assembly packaging, Design of Experiments, Statistical Process Control, equipment development
This role has been open 12 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
296
|
Median days open
57 d
|
Median salary
$172k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (296 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 296 |
| Open roles in the wider Process, Fab & Equipment family | 171 | 9417 · 108 employers |
| Median days open | 70 d | 57 d (+13 d vs this employer) |
| Median salary (USD postings) | — | $172k |
Skills observed across this category: packaging technologies, assembly packaging, Design of Experiments, Statistical Process Control, equipment development
Who's hiring in this category
- KLA Corporation · 49 open roles · median 103 d
- Micron Technology · 37 open roles · median 32 d
- Infineon Technologies · 19 open roles · median 42 d
- Renesas Electronics · 19 open roles · median 22 d
- Lumilens · 13 open roles · median 46 d
- onsemi · 13 open roles · median 25 d
How we counted: 296 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.