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Amazon

ASIC III – AMZ010066

Amazon Austin, Texas, United States Full-time 2 hours ago
Analog & Mixed-Signal Design

Design and validate DDR and high-bandwidth memory physical layer interfaces for machine learning accelerator chips.

About the role

This role involves designing and validating high-bandwidth memory and DDR memory physical layer interfaces for machine learning accelerator chips and system-on-chip architectures. The work spans 2.5D packaging design, memory subsystem integration, and post-silicon validation and characterization.

What you'll do

  • Design and validate high-bandwidth memory and DDR memory physical layer interfaces for machine learning accelerator chips and system-on-chip architectures.
  • Integrate third-party intellectual property blocks into complex system-on-chip designs and perform advanced 2.5D packaging design for memory subsystems.
  • Perform post-silicon validation and characterization of memory subsystems including bring-up, debug, and performance optimization.
  • Define and implement boot-up initialization sequences, reset flows, and training algorithms for memory controllers and physical layer circuits.
  • Collaborate with physical design teams to define timing constraints and review clock distribution networks for memory interfaces.
  • Perform advanced system-level debugging and root-cause analysis of complex functional and performance issues across bring-up, characterization, validation, and production phases.

What you'll need

  • Experience designing and validating DDR and high-bandwidth memory physical layer interfaces.
  • Background in integrating third-party intellectual property blocks into complex system-on-chip designs and 2.5D packaging design for memory subsystems.
  • Hands-on experience with post-silicon validation, characterization, bring-up, and performance optimization of memory subsystems.
  • Experience defining and implementing boot-up initialization sequences, reset flows, and training algorithms for memory controllers and physical layer circuits.
  • Expertise collaborating on timing constraints and clock distribution networks with physical design teams.

Skills: HBM, DDR, PHY, SoC, post-silicon validation

More semiconductor jobs: Amazon jobs · Signal integrity jobs · Austin jobs

Market context

This role has been open 0 days — well below the 76-day median for High-Speed IO/SerDes Design roles.

High-Speed IO/SerDes Design · Serdes Highspeed

Open roles in category
255
Median days open
76 d
Category median salary (all employers)
$206k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Amazon compares in High-Speed IO/SerDes Design hiring
Metric Amazon All employers we track in this specialty (255 roles · 51 employers)
Open roles in this specialty 2 255
Open roles in the wider Analog & Mixed-Signal family 7 1545 · 113 employers
Median days open 26 d 76 d (−50 d vs this employer)
Median salary (USD postings) — $206k

Skills observed across this category: HBM, DDR, PHY, SoC, post-silicon validation

Who's hiring in this category

  • Synopsys · 35 open roles · median 38 d
  • AMD · 24 open roles · median 46 d
  • Cadence Design Systems · 21 open roles · median 150 d
  • Qualcomm · 17 open roles · median 84 d
  • NVIDIA · 16 open roles · median 211 d
  • Micron Technology · 11 open roles · median 49 d

How we counted: 255 open High-Speed IO/SerDes Design (Serdes Highspeed) roles from 51 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Analog & Mixed-Signal family row. Figures refresh nightly.

Amazon

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Austin, Texas, United States
On-site
Full-time
2 hours ago

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