Applications Engineer – Semiconductor 3D X-ray Solutions - Benicia, CA, United States
$108,000 - $148,500 USD yearly
Originally posted 23 July 2026 by the employer.
About the role
As an Applications Engineer, you will join a team focused on 3D X-ray solutions for semiconductor applications, collaborating with customers and internal teams to enable inspection, metrology, and failure analysis workflows. The role interfaces with semiconductor manufacturing facilities, failure analysis laboratories, and R&D centers across front-end and back-end processes.
What you'll do
- Lead system demonstrations, evaluations, and beta-site executions for semiconductor customers including fabs, FA labs, and R&D centers. - Develop and optimize applications, methodologies, and workflows tailored to semiconductor devices, processes, and packaging technologies. - Perform tool characterization, benchmarking, and baseline performance studies for semiconductor use cases. - Provide technical input to product development teams by informing system specifications based on customer requirements and application gaps. - Deliver advanced customer training on system operation, data acquisition, and data analysis workflows. - Deliver technical presentations, support industry conferences and trade shows, and author technical papers.
What you'll need
- BS or MS degree in a relevant technical field (e.g., Materials Science, Physics, Electrical Engineering, or related discipline). - 3–5 years of experience in a semiconductor-related field (e.g., fabs, failure analysis, metrology, or process development). - Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment. - Ability and willingness to travel up to 30% domestically and internationally.
Nice to have
- Background in microscopy or advanced imaging techniques (e.g., X-ray CT, SEM, FIB). - Working knowledge of X-ray absorption principles and imaging/optical fundamentals. - Experience with semiconductor capital equipment, particularly in inspection, metrology, or FA workflows. - Familiarity with advanced semiconductor technologies (e.g., 3D IC, heterogeneous integration, advanced packaging).
This role has been open 154 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (302 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 1123 | 10039 · 106 employers |
| Median days open | 120 d | 59 d (+61 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 42 open roles · median 135 d
- Micron Technology · 40 open roles · median 41 d
- Renesas Electronics · 21 open roles · median 45 d
- Intel Corporation · 20 open roles · median 27 d
- GlobalFoundries · 14 open roles · median 67 d
- Lumilens · 13 open roles · median 78 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.