$136,300 - $231,700 USD yearly
Originally posted 4 June 2026 by the employer. Relisted by the employer on 21 August 2026.
About the role
This role involves developing deep learning, foundation models, and GenAI algorithms for image processing and computer vision applications within the Broadband Plasma Division for semiconductor process control.
What you'll do
- Design, implement, and analyze deep learning and GenAI modeling prototypes. - Perform model training and tuning on domain datasets, evaluating performance against defined metrics and diagnosing bottlenecks. - Design and optimize deep learning model architectures, including novel modules, efficient backbones, and model compression techniques such as distillation. - Optimize deep learning or GenAI model throughput, latency, and cost through mixed-precision and low-precision inference and training (FP16, FP8). - Present technical concepts, modeling prototypes, and validation results in professional technical settings.
What you'll need
- Ph.D. with 0 years of related experience, or Master’s degree with 3 years of related experience, in Electrical Engineering, Computer Science, or a related quantitative field. - Academic or industrial experience applying deep learning or GenAI to real-world problems with demonstrated impact. - Hands-on experience with deep learning model optimization and distillation for mixed or reduced precision (e.g., FP16, FP8) to enhance throughput, latency, and deployment efficiency. - Proficiency in Python and at least one additional programming language among C++, Java, Rust, or Go. - Proficiency in at least one deep learning framework, such as PyTorch, TensorFlow, or JAX. - Technical publications in relevant conferences (e.g., NeurIPS, CVPR, ICML, ICLR, KDD, SIGGRAPH), industrial patents, or impactful open-source project contributions. - Ability and willingness to travel up to 10%.
Nice to have
- Experience developing and optimizing Vision Foundation Models (VFM) or Vision Language Models (VLM). - Experience with GenAI coding tools. - Experience in semiconductor process control.
This role has been open 141 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (302 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 512 | 10080 · 106 employers |
| Median days open | 134 d | 59 d (+75 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation (this employer) · 42 open roles · median 135 d
- Micron Technology · 40 open roles · median 41 d
- Renesas Electronics · 21 open roles · median 45 d
- Intel Corporation · 20 open roles · median 27 d
- GlobalFoundries · 14 open roles · median 67 d
- Lumilens · 13 open roles · median 78 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.