Advanced Package Design Engineer - San Jose, CA, United States
$110,000 USD yearly
Originally posted 11 February 2026 by the employer.
Design silicon and organic interposers for chiplet-based architectures using tools like Virtuoso/APD and Siemens Xpedition.
About the role
As an Advanced Package Design Engineer on the Packaging Engineering team at SK Hynix America, you will design and optimize high-performance, high-density interposers for chiplet-based architectures and heterogeneous integration solutions. You will collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver manufacturable package solutions.
What you'll do
- Design silicon and organic interposers for advanced packaging solutions. - Utilize EDA tools including Virtuoso/APD, Synopsys Custom Compiler, and Siemens Xpedition to create and verify advanced package layouts. - Perform design studies and what-if scenario analyses for packaging schemes to optimize overall package design. - Create and maintain layout design rules, stack-ups, and layout guidelines. - Collaborate with internal and external stakeholders to support advanced packaging technology development.
What you'll need
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Material Science, or a related field. - 3+ years of experience in semiconductor package design or layout. - Experience with layout tools including Virtuoso/APD, Synopsys Custom Compiler, or Siemens Xpedition. - Understanding of high-speed signal routing and power distribution networks (PDN). - Familiarity with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies.
Nice to have
- Currently pursuing a PhD degree in Electrical Engineering or a related field. - 5+ years of experience in advanced packaging layout design. - Experience with SI/PI simulation tools including Ansys, HFSS, or ADS. - Understanding of advanced packaging materials, their interactions, failure mechanisms, and analytical techniques.
Skills: Interposers, chiplet-based architectures, heterogeneous integration, PCB, SI/PI, thermal
This role has been open 211 days — well above the 49-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
69
|
Median days open
49 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SK Hynix America | All employers we track in this specialty (69 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 69 |
| Median days open | 211 d | 49 d (+162 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: Interposers, chiplet-based architectures, heterogeneous integration, PCB, SI/PI, thermal
Who's hiring in this category
- AMD · 10 open roles · median 33 d
- Micron Technology · 9 open roles · median 178 d
- Marvell Technology · 6 open roles · median 23 d
- NVIDIA · 6 open roles · median 48 d
- Broadcom · 4 open roles · median 148 d
- GlobalFoundries · 4 open roles · median 116 d
How we counted: 69 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 26 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.