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Micron Technology

Advanced CMOS Device & Process Integration Engineer - Hiroshima - Fab 15, Japan

Micron Technology Hiroshima - Fab 15, Japan Full-time 11 days ago
Process & Device Engineering

Originally posted 24 September 2026 by the employer.

About the role

As a Principal Advanced CMOS Device & Process Integration Engineer, you will establish technical direction for advanced CMOS device and process integration. This role focuses on shaping current and future CMOS platforms for advanced memory products.

What you'll do

  • Define the technical strategy and long-term roadmap for advanced CMOS devices and process integration.
  • Establish device architecture, process integration, performance, power, area, reliability, yield, and cost targets for future technology generations.
  • Lead the resolution of complex transistor performance, variability, reliability, yield, and process integration challenges.
  • Provide technical leadership for Design Technology Co-Optimization and System Technology Co-Optimization activities.
  • Define and scale AI-assisted engineering strategies for data analytics, coding, knowledge retrieval, experiment optimization, predictive modeling, anomaly detection, and technical decision support.
  • Mentor senior engineers, technical leads, and future subject-matter experts.

What you'll need

  • MS or PhD in Electrical Engineering, Electronic Engineering, Semiconductor Engineering, Applied Physics, Materials Science, or a related field.
  • Extensive industry experience in advanced CMOS device technology, process integration, or transistor development.
  • Expert-level understanding of CMOS transistor physics, process integration, electrical characterization, variability, reliability, and manufacturability.
  • Demonstrated success in leading complex technology development or pathfinding programs.
  • Proven ability to solve highly ambiguous, multidisciplinary technical problems.
  • Strong record of delivering measurable improvements in performance, power, area, reliability, yield, process margin, development cycle time, or manufacturing cost.

Nice to have

  • Recognized expertise in FinFET, Nanosheet, lateral GAA, vertical GAA, CFET, or future CMOS device architectures.
  • Experience leading advanced CMOS technology from pathfinding through qualification and high-volume manufacturing.
  • Deep understanding of DRAM peripheral CMOS requirements and the interaction between memory architecture, circuit design, CMOS technology, and manufacturing.
  • Extensive experience with TCAD, compact modeling, SPICE model validation, DTCO, STCO, or technology benchmarking.
  • Experience defining advanced test structures, process control strategies, and electrical characterization methodologies.
  • Track record of patents, publications, major technical innovations, or industry-recognized contributions.
  • Experience building scalable engineering analytics, automation, AI, or machine-learning methodologies.
  • Experience working with global research organizations, equipment suppliers, foundry partners, or academic institutions.

Skills: CMOS device architecture, process integration, transistor development, technology roadmaps, DTCO

Market context

This role has been open 0 days — well below the 58-day median for Process Integration roles.

Process Integration · Process Integration

Open roles in category
221
Median days open
58 d
Median salary
$160k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in Process Integration hiring
Metric Micron Technology All employers we track in this specialty (221 roles · 37 employers)
Open roles in this specialty 81 221
Open roles in the wider Process, Fab & Equipment family 1468 9525 · 109 employers
Median days open 57 d 58 d (−1 d vs this employer)
Median salary (USD postings) — $160k

Skills observed across this category: CMOS device architecture, process integration, transistor development, technology roadmaps, DTCO

Who's hiring in this category

  • Micron Technology (this employer) · 77 open roles · median 59 d
  • GlobalFoundries · 24 open roles · median 93 d
  • Intel Corporation · 14 open roles · median 50 d
  • Infineon Technologies · 9 open roles · median 43 d
  • onsemi · 9 open roles · median 43 d
  • Renesas Electronics · 8 open roles · median 56 d

How we counted: 221 open Process Integration (Process Integration) roles from 37 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
Hiroshima - Fab 15, Japan
On-site
Full-time
11 days ago

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