2027 Undergrad Thermal Engineering Intern/Co-Op - TX, Austin, United States
Originally posted 11 October 2026 by the employer.
Join AMD to support the development of advanced cooling technologies for AI, high-performance computing, and data center platforms.
About the role
As a Thermal Engineering intern/co-op, you will support the development of advanced cooling technologies for AI, high-performance computing, and data center platforms.
What you'll do
- Characterize thermal and hydraulic aspects of cooling solutions, including cold plates, manifolds, heat exchangers, coolant loops, and rack-level cooling systems.
- Evaluate air-cooled and liquid-cooled platforms through thermal, airflow, coolant-flow, and pressure-drop analysis activities.
- Support laboratory testing, instrumentation setup, sensor deployment, data acquisition, and thermal validation activities.
- Develop scripts and tools that automate test execution, data processing, engineering analysis, and reporting activities.
- Conduct thermal modeling, simulation, and comparison of measured data against design expectations to identify trends and support performance improvements.
- Investigate thermal, flow, and power-related issues and collaborate with engineering teams to identify effective solutions.
What you'll need
- Current enrollment in a U.S.-based university pursuing a Bachelor's or Master's degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or a related engineering discipline.
- Knowledge or experience with heat transfer, thermodynamics, fluid mechanics, thermal-fluid systems, or engineering analysis.
- Knowledge or experience with thermal management solutions, liquid cooling technologies, electronics cooling concepts, cold plates, heat exchangers, thermal interface materials, airflow management, or coolant flow systems.
- Knowledge or experience with laboratory testing, instrumentation, sensors, thermal characterization, data acquisition systems, or experimental validation methodologies.
- Knowledge or experience with CAD software such as SolidWorks or Creo.
- Knowledge or experience with CFD software, thermal simulation tools, or engineering analysis software including ANSYS Icepak, Fluent, FloTHERM, COMSOL, or OpenFOAM.
Nice to have
- Exposure to AI infrastructure, high-performance computing systems, server technologies, data center platforms, or energy-efficient cooling technologies.
This role has been open 0 days — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
940
|
Median days open
50 d
|
Median salary
$158k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (940 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 46 | 940 |
| Open roles in the wider Software, Firmware & Systems family | 407 | 6028 · 146 employers |
| Median days open | 51 d | 50 d (+1 d vs this employer) |
| Median salary (USD postings) | — | $158k |
Who's hiring in this category
- Intel Corporation · 70 open roles · median 30 d
- KLA Corporation · 59 open roles · median 39 d
- Applied Materials · 50 open roles · median 59 d
- NVIDIA · 49 open roles · median 65 d
- Teradyne · 48 open roles · median 23 d
- AMD (this employer) · 43 open roles · median 59 d
How we counted: 940 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 11 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.