$52,000 - $200,000 USD yearly
Originally posted 2 September 2026 by the employer.
Join the Wafer Packaging Manufacturing (WPM) Die Pick organization.
About the role
As a Die Pick Module Equipment Technician, you will be responsible for maintaining, troubleshooting, and improving manufacturing equipment performance. This role is critical to semiconductor wafer processing, testing, and die to wafer assembly within Intel New Mexico's Wafer Packaging Manufacturing (WPM) Die Pick organization.
What you'll do
- Perform electrical and mechanical troubleshooting to diagnose issues with non-functioning manufacturing equipment.
- Dismantle, adjust, repair, install, and assemble equipment using layout plans, blueprints, operating manuals, and technical documentation.
- Execute equipment setup, calibration, and preventative maintenance; coordinate with equipment suppliers for service and repairs.
- Monitor, analyze, and interpret equipment and performance data to improve tool reliability, availability, and overall module performance.
- Document system failures, update existing equipment specifications, and create new specifications supporting equipment maintenance and performance.
- Partner with Module Engineering to execute experiments, equipment configuration changes, and data collection activities.
What you'll need
- Associate degree in a technical field and 2+ years of experience in equipment maintenance or a related discipline OR
- High School Diploma or GED and 4+ years of hands-on manufacturing experience in a relevant technical environment OR
- High School Diploma or GED and 4+ years of military technical experience OR
- High School Diploma or GED and 2+ years of experience in equipment maintenance or a closely related technical field OR
- High School Diploma or GED and 3+ years of technical or trade certification.
Nice to have
- Experience maintaining semiconductor manufacturing equipment.
- Proficiency using hand tools, electrical meters, and calibration tools.
This role has been open 44 days — below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
966
|
Median days open
50 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (966 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 73 | 966 |
| Open roles in the wider Software, Firmware & Systems family | 205 | 6119 · 145 employers |
| Median days open | 35 d | 50 d (−15 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation (this employer) · 74 open roles · median 35 d
- KLA Corporation · 65 open roles · median 43 d
- Teradyne · 57 open roles · median 29 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 50 open roles · median 65 d
- AMD · 47 open roles · median 49 d
How we counted: 966 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.