Originally posted 6 August 2026 by the employer.
About the role
Mueon is hiring a Thermal Systems Engineer or Lead to develop liquid cooling solutions for AI computing platforms. The role covers cooling hardware from silicon and cold plates to trays, coolant distribution, and rack-level integration.
What you'll do
- Lead the design and development of liquid cooling solutions for high-performance AI computing platforms.
- Define thermal architectures spanning silicon, packages, boards, trays, and rack-level systems.
- Own cooling solutions from concept through production, including cold plate design, supplier engagement, qualification, and production release.
- Develop and execute thermal characterization plans to evaluate cooling performance, pressure drop, thermal resistance, reliability, and manufacturability.
- Drive design tradeoffs across thermal performance, reliability, manufacturability, serviceability, and cost with silicon, packaging, power delivery, and mechanical teams.
- Support hardware bring-up, thermal characterization, and root-cause analysis during system development.
What you'll need
- B.S. or M.S. in Mechanical Engineering or a related field (or equivalent experience).
- 7+ years of experience developing thermal management solutions for high-performance electronics.
- Experience designing, manufacturing, and validating single-phase liquid cooling systems for production hardware.
- Understanding of thermal characterization, experimental methods, and cooling system design.
- Experience collaborating across mechanical, electrical, silicon, packaging, manufacturing, and system engineering teams.
Nice to have
- Experience designing microchannel cold plates or advanced cold plate technologies.
- Experience with vapor chambers, advanced heat spreaders, or thermal interface technologies.
- Experience designing tray-, server-, or rack-scale cooling systems.
- Experience developing qualification plans and reliability methodologies for liquid cooling hardware.
- Experience with cooling system components including manifolds, pumps, hoses, quick disconnects, and coolant distribution systems.
- Experience with CFD tools such as Ansys Fluent, Icepak, STAR-CCM+, or equivalent.
- Experience developing two-phase cooling solutions.
More semiconductor jobs: Hardware design jobs · Hillsboro jobs
First seen in our index 0 days ago, well below the 47-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1150
|
Median days since first seen
47 d
|
Category median salary (all employers)
$148k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Mueon | All employers we track in this specialty (1150 roles · 109 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 1150 |
| Open roles in the wider Software, Firmware & Systems family | 3 | 6574 · 158 employers |
| Median days since first seen | 0 d | 47 d (+47 d vs this employer) |
| Median salary (USD postings) | n/a | $148k |
Who's hiring in this category
- Intel Corporation · 90 open roles · median 34 d
- KLA Corporation · 68 open roles · median 61 d
- NVIDIA · 61 open roles · median 74 d
- Teradyne · 59 open roles · median 53 d
- Applied Materials · 58 open roles · median 46 d
- ASML · 57 open roles · median 20 d
How we counted: 1150 open Hardware Systems Engineering (AI ML Hardware) roles from 109 employers tracked in the SemiconductorJobs index, counted 11 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Software, Firmware & Systems family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.