Thermal Mechanical Engineer (Teradyne, Agoura Hills, CA)
$100,000 - $160,000 USD yearly
Originally posted 31 July 2026 by the employer. Relisted by the employer on 17 September 2026.
About the role
As a Thermal Mechanical Engineer, you will own thermal design recommendations, model-to-test correlation, liquid cooling trade-offs, design verification, and closure of thermal risks for complex semiconductor capital equipment. This role involves meaningful technical ownership across design, analysis, prototype, integration, and validation work.
What you'll do
- Own thermal analysis and validation plans for assigned components or subsystems.
- Perform thermal analysis, liquid cooling analysis, and CFD modeling to support design decisions.
- Correlate simulation results with experimental test data and translate findings into clear design recommendations.
- Lead design reviews for assigned scope and drive closure of thermal risks, action items, and verification gaps.
- Collaborate with suppliers and cross-functional teams on manufacturable thermal-mechanical solutions.
What you'll need
- Bachelor's degree in Mechanical Engineering or related discipline with 5+ years of relevant experience, or Master's degree with 3+ years of relevant experience.
- Strong experience with board-level thermal analysis, liquid cooling, cold plates, and thermal-mechanical design.
- Experience using thermal or CFD tools such as Flotherm, SolidWorks Flow Simulation, or similar tools.
- Experience with liquid delivery systems such as pumps, filters, piping, fittings, and cooling loops.
- Proficiency with SOLIDWORKS and PDM or similar engineering data management systems.
- Ability to independently solve engineering problems, make sound design trade-offs, and communicate recommendations clearly.
Nice to have
- Experience with semiconductor test equipment, high-density electronics, or capital equipment.
- Experience with cooling distribution hardware, liquid-cooled platform architecture, custom fluid connectors, or thermal design verification.
- Experience with printed circuit board tools such as CircuitWorks or Allegro.
- Experience correlating thermal models to experimental test data.
- Familiarity with SEMI standards.
This role has been open 79 days — well above the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
963
|
Median days open
51 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Teradyne | All employers we track in this specialty (963 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 57 | 963 |
| Open roles in the wider Software, Firmware & Systems family | 106 | 6118 · 145 employers |
| Median days open | 31 d | 51 d (−20 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation · 73 open roles · median 36 d
- KLA Corporation · 65 open roles · median 44 d
- Teradyne (this employer) · 57 open roles · median 30 d
- NVIDIA · 51 open roles · median 68 d
- Applied Materials · 50 open roles · median 66 d
- AMD · 47 open roles · median 50 d
How we counted: 963 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 18 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.