Thermal Engineer (Teradyne, Agoura Hills, CA)
$81,600 - $129,600 USD yearly
Originally posted 13 October 2026 by the employer.
Join the Memory Test Division team.
About the role
This role involves supporting the thermal architecture, design, analysis, and validation of advanced semiconductor test systems across multiple memory test platforms. You will develop innovative thermal solutions for high-performance semiconductor test equipment.
What you'll do
- Design and develop thermal management solutions for semiconductor test equipment and associated subsystems.
- Perform thermal analysis, airflow modeling, and temperature characterization to support new product development efforts.
- Evaluate cooling technologies, heat transfer solutions, and temperature control strategies for electro-mechanical systems.
- Conduct laboratory testing, thermal characterization, and validation activities to verify design performance.
- Support root cause investigations and corrective actions for thermal-related product issues.
- Collaborate with manufacturing and supplier partners to ensure robust and manufacturable thermal solutions.
What you'll need
- Bachelor of Science degree in Mechanical Engineering or related engineering discipline.
- 2-4 years of engineering experience with thermal design, analysis, or product development.
- Strong understanding of heat transfer, thermodynamics, fluid mechanics, and thermal management principles.
- Experience using CAD tools and engineering documentation practices.
- Strong analytical, problem-solving, and troubleshooting skills.
- Excellent communication and collaboration skills.
Nice to have
- Master's degree in Mechanical Engineering with a thermal sciences focus.
- Experience with semiconductor test equipment, capital equipment, or complex electro-mechanical systems.
- Experience with CFD and thermal simulation tools such as Ansys Icepak, FloTHERM, or similar platforms.
- Experience supporting automation systems, precision mechanisms, and electronics packaging.
- Knowledge of product validation, reliability testing, and design-for-manufacturing principles.
This role has been open 1 day — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
964
|
Median days open
50 d
|
Median salary
$155k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Teradyne | All employers we track in this specialty (964 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 55 | 964 |
| Open roles in the wider Software, Firmware & Systems family | 105 | 6140 · 145 employers |
| Median days open | 27 d | 50 d (−23 d vs this employer) |
| Median salary (USD postings) | — | $155k |
Who's hiring in this category
- Intel Corporation · 71 open roles · median 33 d
- KLA Corporation · 65 open roles · median 42 d
- Teradyne (this employer) · 55 open roles · median 27 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 49 open roles · median 63 d
- AMD · 45 open roles · median 44 d
How we counted: 964 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 15 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.