Thermal Analysis Engineer - Arizona, Phoenix, United States
$164,470 - $232,190 USD yearly
Originally posted 1 October 2026 by the employer.
About the role
This role involves driving scientific innovation and research to shape semiconductor technologies by designing, simulating, and developing novel devices, packages, and interconnects.
What you'll do
- Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations for novel devices and systems.
- Design and fabricate prototypes to demonstrate proof-of-concepts for packaging and interconnect technologies.
- Perform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing.
- Develop process solutions across production modules such as lithography, etch, diffusion, CVD, PVD, and CMP.
- Plan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results.
- Develop models and measurements to advance understanding of device physics, packaging, and systems for future technology platforms.
What you'll need
- Bachelor's or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
- 6+ years of experience with a bachelor's degree, 4+ years with a master's degree, or 2+ years with a PhD.
- Advanced experience in semiconductor fabrication processes such as lithography, etch, diffusion, and packaging design methodologies.
- Advanced experience in simulation tools (e.g., Ansys, Abaqus) for finite element analysis and computational fluid dynamics.
- Advanced experience in programming skills in Python or MATLAB for engineering applications.
- Hands-on experience with experimental setups and data analysis techniques for lab testing.
- Experience with advanced packaging technologies, including EMIB and Foveros architectures.
- Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
- Familiarity with materials characterization techniques and cross-disciplinary collaboration.
Nice to have
- Proven ability to lead and influence technical teams.
- Strong analytical and problem-solving abilities.
- Excellent organizational and communication skills, with experience presenting findings and mentoring team members.
This role has been open 8 days — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
939
|
Median days open
50 d
|
Median salary
$157k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (939 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 70 | 939 |
| Open roles in the wider Software, Firmware & Systems family | 189 | 6078 · 146 employers |
| Median days open | 29 d | 50 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $157k |
Who's hiring in this category
- Intel Corporation (this employer) · 70 open roles · median 27 d
- KLA Corporation · 57 open roles · median 41 d
- NVIDIA · 53 open roles · median 63 d
- Teradyne · 47 open roles · median 21 d
- Applied Materials · 46 open roles · median 58 d
- AMD · 44 open roles · median 61 d
How we counted: 939 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.