Originally posted 27 July 2026 by the employer.
About the role
This role involves supporting semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding, Wire Bonding, and Final Test at onsemi in Negeri Sembilan, Malaysia. The position focuses on operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet quality standards.
What you'll do
- Operate and monitor die bond/clip bonder machines to ensure stable production output.
- Perform die/clip attach processes according to SOP, work instructions, and onsemi quality standards.
- Carry out routine RCM tasks to ensure equipment is in top condition.
- Perform routine checks, cleaning, and minor preventive maintenance.
- Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
- Record production data accurately in the system and ensure proper documentation.
What you'll need
- Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields.
- Basic troubleshooting and machine-handling skills.
- Willingness to work shifts.
- Experience in semiconductor die attach/die bonding/wire bonding/mold-trim/final test process.
- Experience with turret-based handler, Gravity feed Test handler, multisite discrete, and analog testing.
More semiconductor jobs: onsemi jobs · Equipment engineering jobs · Malaysia jobs
First seen in our index 108 days ago, well above the 51-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
4050
|
Median days since first seen
51 d
|
Category median salary (all employers)
$118k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (4050 roles · 87 employers) |
|---|---|---|
| Open roles in this specialty | 93 | 4050 |
| Open roles in the wider Process, Fab & Equipment family | 262 | 10421 · 120 employers |
| Median days since first seen | 52 d | 51 d (−1 d vs this employer) |
| Median salary (USD postings) | n/a | $118k |
Who's hiring in this category
- Applied Materials · 732 open roles · median 37 d
- Lam Research · 557 open roles · median 43 d
- KLA Corporation · 317 open roles · median 57 d
- Micron Technology · 253 open roles · median 60 d
- ASML · 201 open roles · median 79 d
- ASM International · 165 open roles · median 78 d
How we counted: 4050 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 87 employers tracked in the SemiconductorJobs index, counted 13 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.