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onsemi

TECHNICIAN 4, MANUFACTURING - Seremban, Negeri Sembilan, Malaysia

onsemi Seremban, Negeri Sembilan, Malaysia 19 days ago
Manufacturing & Equipment Engineering

Originally posted 15 September 2026 by the employer — open 1 day.

About the role

This role involves supporting semiconductor manufacturing operations, specifically in Die Bond/Clip Bonding, by operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet quality standards.

What you'll do

  • Operate and monitor die bond/clip bonder machines to ensure stable production output.
  • Perform die/clip attach processes according to SOP, work instructions, and quality standards.
  • Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.
  • Perform regular machine checks, cleaning, and minor preventive maintenance.
  • Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
  • Assist in troubleshooting equipment issues and support engineering improvement activities.

What you'll need

  • Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields.
  • Basic troubleshooting and machine-handling skills.
  • Able to work in shift.

Skills: die bond/clip bonder machines, production processes, machine setup, preventive maintenance, troubleshoot equipment

Market context

This role has been open 0 days — well below the 55-day median for Manufacturing/Industrial Engineering roles.

Manufacturing/Industrial Engineering · Manufacturing Equipment

Open roles in category
2255
Median days open
55 d
Median salary
$103k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How onsemi compares in Manufacturing/Industrial Engineering hiring
Metric onsemi All employers we track in this specialty (2255 roles · 83 employers)
Open roles in this specialty 85 2255
Open roles in the wider Process, Fab & Equipment family 269 9331 · 109 employers
Median days open 62 d 55 d (+7 d vs this employer)
Median salary (USD postings) — $103k

Skills observed across this category: die bond/clip bonder machines, production processes, machine setup, preventive maintenance, troubleshoot equipment

Who's hiring in this category

  • Micron Technology · 390 open roles · median 93 d
  • Entegris · 224 open roles · median 40 d
  • Applied Materials · 203 open roles · median 49 d
  • Lam Research · 108 open roles · median 49 d
  • Infineon Technologies · 98 open roles · median 38 d
  • onsemi (this employer) · 84 open roles · median 63 d

How we counted: 2255 open Manufacturing/Industrial Engineering (Manufacturing Equipment) roles from 83 employers tracked in the SemiconductorJobs index, counted 16 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
Seremban, Negeri Sembilan, Malaysia
On-site
19 days ago

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