Technical Engagement Manager (FaST) - Hsinchu, Taiwan
Originally posted 22 September 2026 by the employer — open 0 days.
About the role
This role involves advancing business priorities by defining and executing customer-specific product penetration, positioning, and market share strategies within the advanced packaging domain.
What you'll do
- Define and execute customer specific product penetration, positioning, and market share strategies.
- Develop relationships with key customer technical buying influences.
- Collaborate with FaST Marketing, Engineering, and Home teams to deliver differentiated product value and resolve customer issues.
- Work jointly with the BU and Service teams to execute PSA objectives.
- Jointly develop sales strategies in collaboration with account managers.
- Mentor and coach engineers.
What you'll need
- Strong background in Advanced Packaging process flow and CD/Film metrology control.
- 5 years IC/Fab experience with KLA tool knowledge (Film, SCD, etch, thin film, defect/inspection).
- B.A./M.S. in an engineering/science-based field.
- Good presentation and project management skills.
- Good business acumen with understanding of customer technical issues and customer-focus.
Nice to have
- KLA tool knowledge: Film, SCD, etch, thin film is preferred; defect/inspection is also considered.
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
296
|
Median days open
57 d
|
Median salary
$172k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (296 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 50 | 296 |
| Open roles in the wider Process, Fab & Equipment family | 410 | 9417 · 108 employers |
| Median days open | 103 d | 57 d (+46 d vs this employer) |
| Median salary (USD postings) | — | $172k |
Who's hiring in this category
- KLA Corporation (this employer) · 49 open roles · median 103 d
- Micron Technology · 37 open roles · median 32 d
- Infineon Technologies · 19 open roles · median 42 d
- Renesas Electronics · 19 open roles · median 22 d
- Lumilens · 13 open roles · median 46 d
- onsemi · 13 open roles · median 25 d
How we counted: 296 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.