Tech Proj/Prog Manager III S
$133,500 - $183,500 USD yearly
Originally posted 13 August 2026 by the employer.
About the role
This role drives technical program management and product planning for Special Substrate Handling (SSH) platforms from conception through implementation across business units. The focus covers systems integration, robotics, automation, and handling solutions for non-standard substrates across advanced packaging architectures including CoWoS, chiplets, 2.5D/3D integration, and panel-level packaging.
What you'll do
- Prepare project plans, manage project schedules, track task details, and drive execution across cross-functional engineering, robotics, automation, and software teams.
- Own the SSH product vision, roadmap, and business case across business units, translating advanced packaging technology trends into prioritized platform requirements.
- Act as the systems integration leader for SSH capabilities across multiple product platforms, coordinating resources to meet on-time and within-budget performance objectives.
- Partner with metrology organizations, external vendors, and customers to identify substrate handling requirements, technology gaps, and integration specifications.
- Drive cost-schedule performance of equipment and manage purchase requisitions, purchase orders, and multi-functional program deliverables worldwide.
- Establish program management governance and prioritization frameworks across hardware, software, automation, and subsystem engineering stakeholders.
What you'll need
- 10+ years of experience in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development.
- Technical background in automation, robotics, substrate handling, or systems integration within semiconductor manufacturing equipment.
- Direct experience translating non-standard substrate requirements—such as warped wafers, glass carriers, stacked wafers, thick substrates, or rectangular panels—into system-level specifications.
- Demonstrated experience driving multi-functional project plans, schedules, and budgets using formal project management tools and tracking systems.
- Experience managing hardware, software, and subsystem integration across multi-business-unit initiatives through customer adoption.
Skills: project plans, SSH Platform Management, systems integration, advanced packaging, AI-driven manufacturing
More semiconductor jobs: Applied Materials jobs · Santa Clara jobs
This role has been open 77 days — well above the 55-day median for Technical Program Management roles.
Technical Program Management · Manufacturing Equipment
|
Open roles in category
363
|
Median days open
55 d
|
Category median salary (all employers)
$152k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (363 roles · 43 employers) |
|---|---|---|
| Open roles in this specialty | 86 | 363 |
| Median days open | 46 d | 55 d (−9 d vs this employer) |
| Median salary (USD postings) | — | $152k |
Skills observed across this category: project plans, SSH Platform Management, systems integration, advanced packaging, AI-driven manufacturing
Who's hiring in this category
- Applied Materials (this employer) · 85 open roles · median 48 d
- Lam Research · 74 open roles · median 42 d
- Micron Technology · 37 open roles · median 138 d
- ASML · 21 open roles · median 66 d
- Teradyne · 18 open roles · median 41 d
- KLA Corporation · 13 open roles · median 104 d
How we counted: 363 open Technical Program Management (Manufacturing Equipment) roles from 43 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.