Digital Design & SoC Architecture
About the role
This role involves module-level integration and productization of sensing modules.
What you'll do
- Own module-level integration, bringing subsystems together and debugging integration problems.
- Translate product requirements into quantifiable module specifications and ensure flow-down to subsystem teams.
- Drive system bringup for new hardware, including new silicon, PCBAs, optics, and thermal designs.
- Plan and execute engineering builds, in-house and with contract manufacturers.
- Define test coverage, KPIs, and pass/fail limits across component, subsystem, and module levels.
- Participate in failure analysis and root-cause investigations.
What you'll need
- Master’s or PhD degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, or a related field.
- 5+ years of hands-on systems, hardware, or integration engineering on a physical product.
- Experience carrying at least one hardware product through the full cycle (prototype, engineering builds, production ramp).
- Strong lab skills and debug instinct, comfortable with instrumentation and isolating problems across hardware, firmware, and software.
- Working knowledge of failure analysis practice: structured root cause methods, non-destructive-first triage, corrective action.
- Familiarity with hardware productization mechanics: BOM and change control, travelers, work instructions, IQC/OQC/end-of-line test, yield, DPPM, calibration, serialization, traceability.
- Python for test automation and data analysis.
- Comfort working across optics, electronics, mechanics, and software.
- Clear technical writing and judgment for cross-team collaboration.
- Willingness to travel to manufacturing and vendor sites.
Nice to have
- Experience with new product introduction and engineering builds at contract manufacturers.
- Test station definition, deployment, and correlation.
- Requirements definition and specification flow-down across a multi-team hardware program.
- Concept prototyping and bringup of new silicon or new board designs.
- Experience managing EVT/DVT/PVT cycles and production ramp.
- Domain exposure to LiDAR, cameras, optics, or precision opto-mechanical systems.
Market context
This role has been open 0 days — well below the 45-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
834
|
Median days open
45 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lyte AI | All employers we track in this specialty (834 roles · 100 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 834 |
| Open roles in the wider Software, Firmware & Systems family | 23 | 5829 · 143 employers |
| Median days open | 18 d | 45 d (−27 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- Intel Corporation · 55 open roles · median 23 d
- NVIDIA · 53 open roles · median 45 d
- KLA Corporation · 48 open roles · median 39 d
- AMD · 44 open roles · median 50 d
- Applied Materials · 43 open roles · median 60 d
- Teradyne · 42 open roles · median 51 d
How we counted: 834 open Hardware Systems Engineering (AI ML Hardware) roles from 100 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.