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Applied Materials

Systems Engineer IV - (E4) | Electrical Interconnections and Subsystem Communications - Santa Clara, CA, United States

Applied Materials Santa Clara, CA, United States 5 days ago
Manufacturing & Equipment Engineering

$161,000 - $221,000 USD yearly

Originally posted 5 October 2026 by the employer.

About the role

This role involves designing, integrating, and optimizing complex systems that drive the semiconductor industry forward, with a focus on electrical interconnect architecture and subsystem communications for a complex optical system.

What you'll do

  • Define the system-level electrical interconnect architecture, including harness and cable topology, connector and pin-out standards, power distribution, grounding, shielding, and routing constraints.
  • Derive electrical and communication requirements from customer and system requirements, documenting them in interface control documents (ICDs).
  • Define and own subsystem communication architecture and protocols (e.g., Ethernet/GigE, EtherCAT, CAN, serial, USB, camera/frame-grabber links).
  • Develop and maintain error and noise budgets (EMI/EMC, signal integrity, power integrity, timing) and define subsystem-level requirements.
  • Define and execute system test plans for prototype acceptance and qualification of cables, harnesses, power, and communication subsystems.
  • Troubleshoot and root cause complex system-level electrical, communication, and HW/SW integration issues in manufacturing and the field using oscilloscopes, protocol analyzers, and system logs.

What you'll need

  • BS, MS, or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field.
  • 7+ years of relevant experience with a BS, 5+ years with an MS, or 2+ years with a PhD.
  • Hands-on experience designing, building, and debugging electrical interconnects and electro-mechanical systems (cable/harness design, connectors, power distribution, grounding, and shielding).
  • Working knowledge of industrial and embedded communication interfaces and protocols (Ethernet, EtherCAT, CAN, RS-232/485, USB, camera interfaces) and of timing and trigger signal distribution.
  • Experience reading and creating electrical schematics, wiring diagrams, and interface control documents.
  • Experience with test and measurement equipment (oscilloscopes, logic and protocol analyzers, DMMs, network analyzers).
  • Experience designing and executing test plans and concept and feasibility studies.
  • Strong troubleshooting skills, including system and subsystem level SW debugging based on error messages and SW logs.
  • Proficient with data analysis and visualization; strong scripting experience such as Python or Matlab.

Nice to have

  • Experience with EMI/EMC and signal integrity analysis, mitigation, and compliance testing (SEMI S2, CE).
  • Experience with semiconductor equipment, precision motion systems, or imaging platforms; familiarity with SECS/GEM and fab integration.
  • Experience with EDA or harness design tools (for example EPLAN, SolidWorks Electrical, or Zuken).
  • Familiarity with high-speed imaging data paths (high-speed cameras, frame grabbers, CoaxPress/Camera Link).
  • SW automation experience and AI tools experience (Claude Code and others) a plus.

Skills: electrical interconnect architecture, subsystem communications, optical system, EMI/EMC, test plans

Market context

This role has been open 3 days — well below the 53-day median for Semiconductor Equipment Engineering roles.

Semiconductor Equipment Engineering · Manufacturing Equipment

Open roles in category
3718
Median days open
53 d
Median salary
$126k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Applied Materials compares in Semiconductor Equipment Engineering hiring
Metric Applied Materials All employers we track in this specialty (3718 roles · 82 employers)
Open roles in this specialty 615 3718
Open roles in the wider Process, Fab & Equipment family 1090 9729 · 107 employers
Median days open 53 d 53 d (same as this employer)
Median salary (USD postings) — $126k

Skills observed across this category: electrical interconnect architecture, subsystem communications, optical system, EMI/EMC, test plans

Who's hiring in this category

  • Applied Materials (this employer) · 613 open roles · median 52 d
  • Lam Research · 545 open roles · median 43 d
  • Micron Technology · 269 open roles · median 44 d
  • KLA Corporation · 254 open roles · median 66 d
  • ASML · 198 open roles · median 64 d
  • ASM International · 157 open roles · median 78 d

How we counted: 3718 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 82 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
Santa Clara, CA, United States
On-site
$161,000 - $221,000 USD yearly
5 days ago

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