Subcontract Manufacturing Engineer - Ipoh, Malaysia
Originally posted 24 August 2026 by the employer.
About the role
This role involves the complete operational management of assigned subcontractors in the back-end packaging supply chain.
What you'll do
- Manage subcontractor selection and new product introduction.
- Control bill of materials changes within the supply base.
- Distribute and interpret specifications and drawings for subcontractors.
- Ensure subcontractor adherence to all requirements throughout their processes.
- Support manufacturing for production and engineering lots to optimize throughput and cycle-time.
- Facilitate resolution of technical issues related to module subcontractors.
What you'll need
- Bachelor of Science degree in Science, Engineering, or a related field, or equivalent experience.
- Five years of experience in semiconductor packaging operations, including semiconductor back-end subcontract management.
- Six Sigma Green Belt or equivalent experience.
- Structured Problem Solving Training or equivalent experience.
- Direct functional expertise with backend semiconductor processes.
- Proficiency with MS Word, Excel, PowerPoint, and electronic e-mail systems.
Nice to have
- Master's of Science, Engineering or Graduate Degree in Operations Management, or equivalent.
- Knowledge of operating characteristics of power semiconductor devices and familiarity with industry standard power semiconductor packages.
- Experience with Power Semiconductor devices such as Half-Bridge Power Module assembly processes (die pick & place, Wire Bond, molding, DBCs to base plate attachment, reflow profiling, gel fill, casing assembly, electrical testing).
- Experience leading cross functional teams in problem solving or process development efforts.
Skills: subcontract manufacturing, semiconductor packaging operations, backend semiconductor processes, process qualification, technical issues resolution, power semiconductor devices
This role has been open 35 days — well below the 55-day median for Manufacturing/Industrial Engineering roles.
Manufacturing/Industrial Engineering · Manufacturing Equipment
|
Open roles in category
2268
|
Median days open
55 d
|
Median salary
$100k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Wolfspeed | All employers we track in this specialty (2268 roles · 79 employers) |
|---|---|---|
| Open roles in this specialty | 15 | 2268 |
| Open roles in the wider Process, Fab & Equipment family | 69 | 9494 · 108 employers |
| Median days open | 32 d | 55 d (−23 d vs this employer) |
| Median salary (USD postings) | — | $100k |
Skills observed across this category: subcontract manufacturing, semiconductor packaging operations, backend semiconductor processes, process qualification, technical issues resolution, power semiconductor devices
Who's hiring in this category
- Micron Technology · 382 open roles · median 88 d
- Entegris · 226 open roles · median 40 d
- Applied Materials · 199 open roles · median 42 d
- Lam Research · 107 open roles · median 45 d
- Infineon Technologies · 98 open roles · median 42 d
- onsemi · 81 open roles · median 60 d
How we counted: 2268 open Manufacturing/Industrial Engineering (Manufacturing Equipment) roles from 79 employers tracked in the SemiconductorJobs index, counted 28 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.