STEM/FIB Engineer 2 - US-CA-Livermore (1028), United States
$73,000 - $159,000 USD yearly
Originally posted 22 September 2026 by the employer.
Work with FEI/Thermo Fisher dual-beam Helios focused ion beam (FIB) tools and in-situ 30 keV STEM detectors.
About the role
As a Metrology Process Engineer/Microscopist, you will operate several generations of FEI/Thermo Fisher dual-beam Helios focused ion beam (FIB) tools, including the latest microscopy models, to prepare transmission electron microscopy (TEM) lamellae or image prepared lamella samples using in-situ 30 keV STEM detectors. This role supports Lam Microscopy Services, handling a high volume of samples from multiple business units.
What you'll do
- Prepare TEM lamellae using Thermo Fisher Helios dual-beam FIB tools.
- Set up, operate, and troubleshoot equipment.
- Ensure proper handling of sensitive customer samples and intellectual property.
- Work with process engineers to locate regions of interest, optimize sample processing, interpret data, and troubleshoot.
- Maintain the integrity of experiments and data to provide valid results.
- Actively participate in developing new techniques to expedite sample processing.
What you'll need
- Master’s or Bachelor’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field.
- 2 years of related microscopy experience.
- Ability to work night shift schedule, Sunday through Thursday, 40 hours each week.
Nice to have
- Experience working in an academic or professional laboratory setting.
- Experience operating electron microscopes and/or dual-beam focused ion beam (FIB) tools.
- Experience with TEM sample preparation.
- Experience creating technical documentation.
- Knowledge of semiconductor devices and the industry.
- Experience handling and protecting sensitive customer intellectual property.
Skills: FIB, TEM, STEM, lamellae, microscopy, semiconductor
This role has been open 18 days — well below the 47-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
188
|
Median days open
47 d
|
Median salary
$116k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Lam Research | All employers we track in this specialty (188 roles · 38 employers) |
|---|---|---|
| Open roles in this specialty | 14 | 188 |
| Open roles in the wider Process, Fab & Equipment family | 776 | 9739 · 108 employers |
| Median days open | 35 d | 47 d (−12 d vs this employer) |
| Median salary (USD postings) | — | $116k |
Skills observed across this category: FIB, TEM, STEM, lamellae, microscopy, semiconductor
Who's hiring in this category
- Micron Technology · 31 open roles · median 104 d
- Lam Research (this employer) · 14 open roles · median 35 d
- GlobalFoundries · 12 open roles · median 19 d
- Infineon Technologies · 12 open roles · median 43 d
- Intel Corporation · 11 open roles · median 47 d
- AMD · 10 open roles · median 59 d
How we counted: 188 open Failure Analysis Engineering (Failure Analysis) roles from 38 employers tracked in the SemiconductorJobs index, counted 11 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.