Stage ingénieur : Détection embarquée dans l’habitacle — Collecte et fusion de données multi-capteurs (F/H)
Originally posted 22 September 2026 by the employer — open 0 days.
About the role
This internship focuses on in-cabin sensing and multi-sensor data fusion to build an experimental platform collecting synchronized data from multiple in-cabin sensors.
What you'll do
- Familiarize with the existing in-cabin data-collection setup and its Linux-based software stack.
- Extend the platform with new functionality, including enabling more than one UWB anchor, adding data transport (e.g., MQTT server), and integrating additional sensors and their drivers.
- Verify and characterize timestamp accuracy across sensors for data fusion requirements.
- Collect synchronized multi-sensor datasets and evaluate data quality.
- Provide recommendations on setup architecture, sensor integration, timing/synchronization, and fusion approach.
- Investigate multi-sensor data fusion and application-level measurements such as child-presence detection.
What you'll need
- Final-year master’s student or engineering student in data engineering, embedded systems, signal processing, wireless communications, or robotics.
- Good programming skills in Python and/or C/C++.
- Comfortable working on Linux.
- Knowledge of at least one of: sensor integration, device drivers, data acquisition and synchronization, digital signal processing, or data fusion.
Nice to have
- Familiarity with UWB.
- Familiarity with MQTT or other messaging systems.
- Familiarity with Kalman filtering.
- Familiarity with sensor fusion.
- Familiarity with data visualization.
Skills: in-cabin sensing, multi-sensor fusion, UWB, ROS, Linux
This role has been open 0 days — well below the 97-day median for Embedded Firmware Engineering roles.
Embedded Firmware Engineering · Automotive IC
|
Open roles in category
85
|
Median days open
97 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NXP Semiconductors | All employers we track in this specialty (85 roles · 14 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 85 |
| Open roles in the wider Software, Firmware & Systems family | 126 | 5873 · 143 employers |
| Median days open | 21 d | 97 d (−76 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Skills observed across this category: in-cabin sensing, multi-sensor fusion, UWB, ROS, Linux
Who's hiring in this category
- Infineon Technologies · 19 open roles · median 166 d
- Qualcomm · 18 open roles · median 166 d
- NVIDIA · 12 open roles · median 46 d
- Renesas Electronics · 8 open roles · median 62 d
- NXP Semiconductors (this employer) · 7 open roles · median 74 d
- Arrow Electronics · 6 open roles · median 44 d
How we counted: 85 open Embedded Firmware Engineering (Automotive IC) roles from 14 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.