Staff Product Manager - Data Center High-Speed Connectivity & AI Infrastructure

Originally posted 6 July 2026 by the employer.

Drive product strategy and execution for Qualcomm's high-speed connectivity portfolio covering SerDes, optical networking, PCIe, and chiplet ecosystems.

About the role

As a Staff Product Manager in Qualcomm's Data Center Business Unit, you will drive product strategy, roadmap definition, customer engagement, and execution for high-speed connectivity technologies that enable AI scale-up and scale-out systems. The portfolio covers scale-up fabrics, high-speed I/O, optical networking, PCIe, SerDes, and rack-scale infrastructure.

What you'll do

- Define product strategy and multi-generation roadmaps for high-speed connectivity solutions supporting AI and cloud infrastructure. - Develop market requirements, customer use cases, competitive positioning, and business cases for connectivity technologies across scale-up fabrics, scale-out architectures, and chiplet ecosystems. - Engage directly with hyperscale customers, ecosystem partners, and industry consortiums to translate technical needs into product requirements and roadmap priorities. - Collaborate with architecture and engineering teams to align system-level requirements across silicon, software, systems, packaging, and infrastructure organizations. - Provide product leadership for interconnect technologies including die-to-die connectivity, chiplet ecosystems, high-speed I/O, and optical networking solutions. - Develop business cases, investment recommendations, pricing strategies, and customer engagement plans while tracking product execution metrics.

What you'll need

- Bachelor's degree in Engineering, Information Systems, Computer Science, Humanities, or related field. - 5+ years of Product Management or related work experience.

Nice to have

- 10 years of experience in semiconductor, networking, connectivity, or AI infrastructure markets. - Understanding of high-speed connectivity technologies including PCIe, Ethernet, optical interconnects, die-to-die communication, and chiplet ecosystems. - Experience with AI infrastructure, hyperscale data centers, HPC systems, or cloud architectures. - Understanding of scale-up and scale-out system architectures used in AI and machine learning deployments. - Familiarity with advanced packaging, heterogeneous integration, and high-bandwidth interconnect solutions. - Experience driving products from concept through deployment. - Experience working directly with hyperscale customers, strategic partners, or industry standards organizations.

Skills: product manager, roadmap, market requirements, high-speed connectivity, AI infrastructure, chiplet ecosystems