Skip to main content
Infineon Technologies

Staff Module Package Engineer - Wuxi, 无锡

Infineon Technologies Wuxi, 无锡 15 days ago
Digital Design & SoC Architecture

Originally posted 20 September 2026 by the employer — open 0 days.

This role focuses on the mechanic customization of power semiconductor modules.

About the role

This role involves the mechanical customization of new power semiconductor modules. You will be responsible for the engineering of mechanical details and functions for existing packages and product families.

What you'll do

  • Engineer mechanical details and functions of existing packages and product families.
  • Guide new products from engineering to high-volume production.
  • Define constructive designs considering new materials from supplier to manufacturing concept.
  • Coordinate specific interests with electrical engineering, purchasing, production, and quality assurance.

What you'll need

  • University degree (Bachelor/Master) in mechanical engineering, mechatronics, automation technology or a related field.
  • Experience in independent design and customization of metal and plastic composite components, ceramics, and thermal management.
  • Willingness to travel.
  • Excellent communication skills in English.
Market context

This role has been open 0 days — well below the 44-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
832
Median days open
44 d
Median salary
$159k
See the full market breakdown ▾Category comparison, and who else is hiring
How Infineon Technologies compares in Hardware Systems Engineering hiring
Metric Infineon Technologies All employers we track in this specialty (832 roles · 100 employers)
Open roles in this specialty 19 832
Open roles in the wider Software, Firmware & Systems family 148 5787 · 143 employers
Median days open 32 d 44 d (−12 d vs this employer)
Median salary (USD postings) — $159k

Who's hiring in this category

  • Intel Corporation · 55 open roles · median 22 d
  • NVIDIA · 53 open roles · median 44 d
  • KLA Corporation · 48 open roles · median 38 d
  • AMD · 43 open roles · median 47 d
  • Applied Materials · 43 open roles · median 59 d
  • Teradyne · 42 open roles · median 50 d

How we counted: 832 open Hardware Systems Engineering (AI ML Hardware) roles from 100 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
Wuxi, 无锡
On-site
15 days ago

Share this job