Staff HBM Design Architect
$135,000 - $286,000 USD yearly
Originally posted 17 April 2026 by the employer.
About the role
As a Custom Layout Architecture Engineer within Micron's High Bandwidth Memory Design Architecture team, you will use physical layout expertise to inform HBM architecture and implementation decisions from concept through tapeout. The role focuses on developing memory solutions for AI accelerators, high-performance computing, and data centers.
What you'll do
- Assess HBM architecture choices through layout feasibility, floorplanning, and performance, power, and area analysis.
- Lead custom layout and full-chip integration for analog, mixed-signal, digital, and memory blocks.
- Resolve antenna, latch-up, ESD, electromigration, IR drop, routability, and power-delivery constraints.
- Complete DRC/LVS, parasitic extraction, post-layout validation, and tapeout support using industry-standard EDA tools.
- Build scripts and automation that improve layout quality, verification, and design-cycle time.
What you'll need
- Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related technical field.
- 4+ years of semiconductor physical layout experience with analog, digital, or mixed-signal blocks.
- Proficiency with Cadence Virtuoso VLE/VXL and Siemens Calibre DRC/LVS.
- Experience converting schematics into manufacturable layouts and completing physical verification.
- Ability to explain layout constraints and tradeoffs to design, architecture, and cross-functional teams.
Nice to have
- Master’s degree in Electrical Engineering, Microelectronics, VLSI, or a related field.
- 7+ years of full-custom layout experience with HBM, DRAM, or high-speed memory products.
- Experience with JEDEC HBM specifications, TSV-based 3D stacking, full-chip integration, and macro floorplanning.
- Proficiency with SPICE, FineSim, or HSPICE, along with Python, SKILL, Perl, or Tcl.
- Experience influencing product architecture through layout analysis and using AI-assisted layout workflows.
Skills: HBM Design, DRAM circuits, CMOS circuit design, FineSim, HSPICE, 3D DRAM
More semiconductor jobs: Micron Technology jobs
This role has been open 202 days — well above the 72-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
302
|
Median days open
72 d
|
Category median salary (all employers)
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (302 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 154 | 302 |
| Median days open | 81 d | 72 d (+9 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM Design, DRAM circuits, CMOS circuit design, FineSim, HSPICE, 3D DRAM
Who's hiring in this category
- Micron Technology (this employer) · 154 open roles · median 82 d
- Synopsys · 30 open roles · median 77 d
- Qualcomm · 18 open roles · median 106 d
- Broadcom · 16 open roles · median 78 d
- SanDisk · 15 open roles · median 7 d
- NVIDIA · 8 open roles · median 59 d
How we counted: 302 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.