STAFF ENG-HBM-LAYOUT - Hyderabad - Phoenix Aquila, India
Originally posted 11 September 2026 by the employer — open 8 days.
Focus on High Bandwidth Memory (HBM) layout for intensive applications like artificial intelligence and high performance computing.
About the role
This role involves layout design for High Bandwidth Memory (HBM) within Micron Technology's team in Hyderabad, India. You will contribute to critical design and co-optimization objectives, mixed-signal, custom digital block, and full chip level integration, specifically for HBM applications.
What you'll do
- Design and develop critical Design and Co-optimization objectives, mixed-signal, custom digital block and full chip level integration.
- Build and tapeout PWF Reticles Design.
- Engage with Scribe Design team for Advanced Packaging requirements.
- Perform layout verification like LVS/DRC/Antenna, quality check and documentation.
- Demonstrate leadership in planning, area/time estimation, scheduling, delegation and execution to meet project schedules.
- Guide junior team-members in their execution of Sub block-level layouts & review their work.
What you'll need
- 8 to 15 years' experience in analog/custom layout design in advanced CMOS process, in various technology nodes (Planar, FinFET).
- Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS.
- Hands-on experience in creating layout of critical blocks such as Temperature sensor, PLL, ADC, DAC, LDO, Bandgap, Ref Generators, Charge Pump, Current Mirrors, Comparator, Differential Amplifier.
- Hands-on experience in Reticle development and Full CHip Verification.
- Good understanding of Layout fundamentals (e.g., Matching, Electro-migration, Latch-up, coupling, crosstalk, IR-drop, active and passive parasitic devices).
- Understanding layout effects on the circuit such as speed, capacitance, power and area.
This role has been open 8 days — well below the 54-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
54 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 36 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 1454 | 9314 · 108 employers |
| Median days open | 29 d | 54 d (−25 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 101 d
- Micron Technology (this employer) · 36 open roles · median 28 d
- Renesas Electronics · 21 open roles · median 20 d
- Infineon Technologies · 18 open roles · median 40 d
- Intel Corporation · 13 open roles · median 75 d
- Lumilens · 13 open roles · median 44 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.