Own the thermal-hydraulic performance of Direct-to-Chip (D2C) liquid cooling solutions for high-power ASICs.
Originally posted 11 November 2026 by the employer.
About the role
This role leads the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip (D2C) liquid cooling solutions for AI accelerators and high-density compute platforms. You will own the thermal-hydraulic performance of custom cold plates, interface materials, and fluid delivery subsystems for high-power ASICs.
What you'll do
- Build and execute detailed Computational Fluid Dynamics (CFD) and thermal-resistance network models to evaluate temperature distribution, pressure drop, and flow balancing across cold plates, trays, and racks.
- Co-design liquid cold plates with industry partners to cool high-heat-flux AI processors.
- Specify, select, and qualify thermal interface materials (TIM) for large, high-warpage devices to minimize contact resistance between silicon dies and cold plates.
- Design coolant flow paths, quick-disconnects (QDs), hoses, and cold-plate retention/loading mechanisms in alignment with server chassis and OCP standards.
- Plan and execute physical thermal testing in the lab, including thermocouple instrumentation, pressure/flow mapping, thermal test vehicle (TTV) bring-up, and simulation-to-test correlation.
- Partner with mechanical, electrical, firmware, and supply chain teams to drive PCBA, tray, and system-level designs from NPI to high-volume manufacturing.
What you'll need
- Bachelor's degree in Mechanical or Thermal Engineering with 8+ years of experience, or Master's degree with 6+ years of experience in thermal/mechanical design for high-power electronics, AI hardware, servers, or HPC systems.
- Direct experience designing and deploying Direct Liquid Cooling (DLC) systems, specifically liquid cold plates, coolant distribution units (CDUs), and manifold loops.
- Working knowledge of single-phase and/or two-phase heat transfer, fluid dynamics, pressure drop calculations, and electronics packaging interactions.
- Proficiency in CFD and thermal analysis software.
- Experience with thermal data acquisition systems, flow meters, pressure transducers, and lab automation using Python, MATLAB, or LabVIEW.
Nice to have
- Master's degree in Mechanical or Thermal Engineering.
- Experience with air cooled systems.
- Proficiency in Flotherm, FloEFD, or MacroFlow.
- Experience with electronics packaging and CAD platforms, preferably CREO.
More semiconductor jobs: Broadcom jobs · Hardware design jobs
First seen in our index 0 days ago, well below the 47-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1150
|
Median days since first seen
47 d
|
Category median salary (all employers)
$148k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Broadcom | All employers we track in this specialty (1150 roles · 109 employers) |
|---|---|---|
| Open roles in this specialty | 25 | 1150 |
| Open roles in the wider Software, Firmware & Systems family | 74 | 6577 · 158 employers |
| Median days since first seen | 34 d | 47 d (+13 d vs this employer) |
| Median salary (USD postings) | n/a | $148k |
Who's hiring in this category
- Intel Corporation · 90 open roles · median 34 d
- KLA Corporation · 68 open roles · median 61 d
- NVIDIA · 61 open roles · median 74 d
- Teradyne · 59 open roles · median 53 d
- Applied Materials · 58 open roles · median 46 d
- ASML · 57 open roles · median 20 d
How we counted: 1150 open Hardware Systems Engineering (AI ML Hardware) roles from 109 employers tracked in the SemiconductorJobs index, counted 11 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Software, Firmware & Systems family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.