Sr Wirebond Process Development Engineer - Seremban, Malaysia
Originally posted 30 September 2026 by the employer.
About the role
As a Senior Wirebond Process Development Engineer, you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS).
What you'll do
- Develop and characterize new semiconductor process technologies using DOE, SPC, FMEA, and Six Sigma.
- Drive end-to-end process development from concept to stable, high-yield manufacturing solutions.
- Provide technical input for assembly processes and equipment solutions for new products and platforms.
- Lead technical discussions and troubleshooting on wire bond and related FOL processes.
- Apply wafer metallization knowledge to optimize process performance and stability.
- Use statistical analysis tools (e.g. Minitab/Statistica) to analyze process performance.
What you'll need
- Bachelor’s degree in engineering or an equivalent related field of study.
- At least 5 years of experience in semiconductor or manufacturing environment.
- Hands-on experience in FOL processes (wafer dicing, die bond, plasma, wire bond, AOI).
- Strong knowledge of wire bond packaging technologies.
- Experience applying Six Sigma methodologies and statistical tools (DOE, SPC, FMEA, 8D, Minitab/Statistica).
Skills: wire bond, FOL processes, process development, DOE, SPC
This role has been open 6 days — well below the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
311
|
Median days open
60 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Nexperia | All employers we track in this specialty (311 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 311 |
| Open roles in the wider Process, Fab & Equipment family | 97 | 9631 · 109 employers |
| Median days open | 34 d | 60 d (−26 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: wire bond, FOL processes, process development, DOE, SPC
Who's hiring in this category
- KLA Corporation · 52 open roles · median 117 d
- Micron Technology · 36 open roles · median 38 d
- Renesas Electronics · 21 open roles · median 36 d
- Infineon Technologies · 17 open roles · median 54 d
- onsemi · 15 open roles · median 27 d
- GlobalFoundries · 13 open roles · median 69 d
How we counted: 311 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.