Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions – (Advanced Packaging) (E)
$138,500 - $235,500 USD yearly
Originally posted 16 July 2026 by the employer.
About the role
This role drives the go-to-market strategy, positioning, and growth of Process Control and Yield Enhancement Software solutions for Advanced Packaging. You will work across product management, engineering, sales, and customer engagement to translate customer challenges into product value propositions and influence roadmap decisions.
What you'll do
- Develop and execute product marketing strategies for software solutions supporting advanced packaging applications, including 2.5D/3D packaging, chiplets, heterogeneous integration, wafer-level packaging, and panel-level packaging. - Define value propositions, messaging frameworks, product differentiation strategies, and sales enablement materials. - Partner with semiconductor manufacturers, OSATs, foundries, and IDMs to gather Voice of Customer insights and deliver customer presentations. - Collaborate with Product Management, R&D, and Applications Engineering to influence product roadmap decisions, pricing strategies, and portfolio planning. - Provide global sales teams with tools, training, technical messaging, and competitive battle cards to support key customer opportunities.
What you'll need
- Bachelor's degree in Engineering, Computer Science, Physics, Materials Science, Semiconductor Manufacturing, Business, or a related field. - Minimum 8+ years of relevant experience with a Bachelor's degree, 6+ years with a Master's degree, or 3+ years with a Doctorate. - Professional experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, or process control. - Understanding of semiconductor manufacturing processes, yield management, process control methodologies, and advanced packaging technologies. - Demonstrated experience marketing or supporting software products, analytics platforms, manufacturing solutions, or semiconductor equipment technologies.
Nice to have
- Master's degree, PhD in a technical discipline, or MBA. - Direct experience with advanced packaging technologies including chiplets, TSV, hybrid bonding, heterogeneous integration, and high-bandwidth memory (HBM). - Knowledge of process control software, AI/ML-driven analytics, manufacturing intelligence, or yield management platforms. - Experience working with semiconductor foundries, OSATs, memory manufacturers, or advanced packaging suppliers. - Familiarity with semiconductor inspection, metrology, defect review, or process control workflows. - Global product launch and portfolio management experience.
This role has been open 96 days — well above the 64-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
64 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (297 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 44 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 460 | 10037 · 107 employers |
| Median days open | 132 d | 64 d (+68 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation (this employer) · 43 open roles · median 131 d
- Micron Technology · 38 open roles · median 40 d
- Intel Corporation · 17 open roles · median 63 d
- Renesas Electronics · 16 open roles · median 50 d
- GlobalFoundries · 14 open roles · median 63 d
- Lumilens · 13 open roles · median 74 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 20 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.