Originally posted 15 October 2026 by the employer.
Own the technical readiness, manufacturability, and lifecycle performance of advanced power modules.
About the role
This role involves owning the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining. The position is accountable for end-to-end product execution across design, test, quality, assembly, and manufacturing, with a focus on high-performance digital power VRMs, multiphase controllers, Smart Power Stages (SPS), Vertical Power Stages (SPS with integrated capacitors and multiple silicon die), Power Towers, and power MOSFETs.
What you'll do
- Own product engineering execution for advanced power modules from NPI through high-volume production and sustaining.
- Own the manufacturability of advanced power modules, driving robust assembly processes across OSAT and internal manufacturing sites.
- Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects.
- Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams.
- Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability.
- Lead yield analysis, parametric trend monitoring, and root-cause investigations.
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field.
- 8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production.
- Technical depth in semiconductor power products and advanced power module manufacturing.
- Strong data analysis skills with the ability to interpret statistical results and drive decisions.
- Working knowledge of new product development, qualification, and high-volume manufacturing transfer.
Nice to have
- Master’s degree in a relevant engineering discipline.
- Mechanical Engineering degree, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.
Skills: product engineering execution, advanced power modules, NPI, high-volume production, yield analysis, product specifications
This role has been open 1 day — well below the 69-day median for Product Engineering roles.
Product Engineering · Power Management
|
Open roles in category
43
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Median days open
69 d
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Median salary
—
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See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (43 roles · 16 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 43 |
| Open roles in the wider Silicon Validation & Test family | 117 | 2226 · 113 employers |
| Median days open | 50 d | 69 d (−19 d vs this employer) |
| Median salary (USD postings) | — | — |
Skills observed across this category: product engineering execution, advanced power modules, NPI, high-volume production, yield analysis, product specifications
Who's hiring in this category
- Infineon Technologies · 8 open roles · median 51 d
- Renesas Electronics (this employer) · 5 open roles · median 50 d
- Nexperia · 4 open roles · median 92 d
- onsemi · 4 open roles · median 70 d
- Vishay Intertechnology · 4 open roles · median 83 d
- Texas Instruments · 3 open roles · median 22 d
How we counted: 43 open Product Engineering (Power Management) roles from 16 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Silicon Validation & Test family row. Figures refresh nightly.