Sr Staff Advanced Package Design Engineer - 19001
Originally posted 29 September 2026 by the employer.
About the role
This role involves advanced silicon package design, focusing on delivering innovative solutions for complex semiconductor challenges.
What you'll do
- Collaborate with cross-functional teams to optimize and define SIPI performance requirements, including bump mapping and power estimation.
- Design and develop advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
- Model and analyze advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
- Resolve a wide range of design and integration issues using creative, data-driven approaches.
- Support customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
What you'll need
- Bachelor's degree in Electrical or Electronic Engineering.
- Minimum of 10 years' relevant experience in advanced package design, model extraction, and analysis.
- Expert knowledge of advanced circuit and transmission line theory.
- Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
- Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
- Familiarity with both Windows and Linux operating systems.
- Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.
Skills: advanced package design, silicon interposers, RDL fanout, 3DIC, multi-physics analysis
This role has been open 5 days — well below the 42-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
71
|
Median days open
42 d
|
Median salary
$171k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Synopsys | All employers we track in this specialty (71 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 71 |
| Median days open | 5 d | 42 d (−37 d vs this employer) |
| Median salary (USD postings) | — | $171k |
Skills observed across this category: advanced package design, silicon interposers, RDL fanout, 3DIC, multi-physics analysis
Who's hiring in this category
- Micron Technology · 11 open roles · median 158 d
- Marvell Technology · 8 open roles · median 26 d
- AMD · 6 open roles · median 42 d
- Broadcom · 4 open roles · median 128 d
- Intel Corporation · 4 open roles · median 18 d
- NVIDIA · 4 open roles · median 51 d
How we counted: 71 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.