Sr Staff Advanced Package Design Engineer - 18918
Originally posted 29 September 2026 by the employer.
About the role
This role involves designing, developing, and analyzing advanced silicon package solutions. You will focus on high-performance, energy-efficient chip design using 3DIC and multi-physics analysis.
What you'll do
- Collaborate with cross-functional teams to optimize and define SIPI performance requirements, including bump mapping and power estimation.
- Design and develop advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
- Model and analyze advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
- Act as a technical leader and subject matter expert in advanced packaging for business unit projects.
- Resolve design and integration issues using data-driven approaches.
- Support customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
What you'll need
- Bachelor’s degree in Electrical or Electronic Engineering.
- Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
- Expert knowledge of advanced circuit and transmission line theory.
- Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
- Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
- Familiarity with both Windows and Linux operating systems.
- Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.
Nice to have
- Master’s or PhD in Electrical or Electronic Engineering.
Skills: advanced package design, silicon interposers, RDL fanout, 3DIC, multi-physics analysis
This role has been open 5 days — well below the 42-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
71
|
Median days open
42 d
|
Median salary
$171k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Synopsys | All employers we track in this specialty (71 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 71 |
| Median days open | 5 d | 42 d (−37 d vs this employer) |
| Median salary (USD postings) | — | $171k |
Skills observed across this category: advanced package design, silicon interposers, RDL fanout, 3DIC, multi-physics analysis
Who's hiring in this category
- Micron Technology · 11 open roles · median 158 d
- Marvell Technology · 8 open roles · median 26 d
- AMD · 6 open roles · median 42 d
- Broadcom · 4 open roles · median 128 d
- Intel Corporation · 4 open roles · median 18 d
- NVIDIA · 4 open roles · median 51 d
How we counted: 71 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.