Sr. Principal Product Engineer - Livermore, CA, United States

Originally posted 2 October 2026 by the employer.

Lead the development and continuous advancement of MEMS probe technologies for semiconductor wafer test applications.

About the role

This Sr. Principal Product Engineer will lead the development and continuous advancement of MEMS probe technologies used in semiconductor wafer test applications. This role focuses on ceramic guide plate technology, evaluating new materials and processes, and supporting customer qualification activities.

What you'll do

• Lead the development of ceramic guide plate materials and technologies for MEMS-based vertical probe card products.
• Collaborate with Product Management and Marketing to define new product requirements and technology roadmaps.
• Lead the evaluation, characterization, and qualification of new ceramic guide plate materials and manufacturing processes.
• Develop and execute comprehensive reliability and characterization plans to assess performance.
• Support customer qualification and validation efforts as a primary technical resource.
• Drive continuous product improvement initiatives focused on reliability, quality, manufacturability, and yield.

What you'll need

• Minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a Master’s degree; or a PhD with 3 years experience.
• Experience serving as a technical lead for critical product components and technology platforms.
• Ability to develop and execute comprehensive reliability and characterization plans.
• Experience analyzing customer requirements and translating technical needs into product enhancements.
• Ability to lead root cause investigations and corrective action efforts using data-driven methodologies.
• Experience providing technical leadership across multidisciplinary teams including Product Engineering, R&D, Manufacturing, Quality, Supply Chain, Marketing, and Sales.

Nice to have

• Experience with semiconductor wafer test, probe cards, MEMS structures, or advanced packaging technologies.
• Experience working with advanced ceramic materials and precision mechanical assemblies.
• Proficiency with Python, MATLAB, JMP, or similar data analysis tools.
• Experience with finite element analysis (FEA) and thermo-mechanical modeling using Ansys or SolidWorks Simulation.
• Familiarity with semiconductor reliability testing, qualification methodologies, and product lifecycle management processes.
• Knowledge of competitive technologies and emerging trends within semiconductor test and interconnect solutions.

Skills: MEMS probe technologies, product qualification, reliability, characterization, manufacturing