$138,900 - $182,280 USD yearly
Originally posted 10 August 2026 by the employer.
About the role
This role leads a team of RF Probe Card Designers responsible for the design, development, and release of advanced RF and high-frequency probe card solutions.
What you'll do
- Lead, coach, and develop a team of RF Probe Card Designers.
- Provide technical leadership for the design of complex RF probe card architectures, transmission line structures, and probe technologies.
- Continuously evaluate and improve RF probe card design methodologies, design tools, design rules, and workflows.
- Manage multiple complex development projects simultaneously through various stages of the product lifecycle.
- Own and continuously evolve RF probe card design methodologies to improve quality, predictability, scalability, and design cycle time.
- Utilize Lean, Six Sigma, root-cause analysis, and other structured problem-solving methodologies to eliminate recurring design and product quality issues.
What you'll need
- Minimum 8 years of experience in semiconductor test, RF product development, probe cards, advanced interconnect technologies, microelectronics, or PCB design.
- Minimum 3 years of engineering leadership, technical leadership, or people management experience.
- Strong understanding of RF, microwave, and high-speed electrical design principles.
- Experience with RF probe cards, RF interposers, test interfaces, substrates, or related semiconductor test hardware.
- Demonstrated experience developing and implementing engineering design methodologies, standards, and best practices.
- Working knowledge of DFMEA, PFMEA, Ishikawa, IS/IS NOT, root-cause analysis, and corrective action methodologies.
Nice to have
- Bachelor's degree in Electrical Engineering, Physics, or related engineering discipline.
- Demonstrated success leading cross-functional development projects from concept through production release.
- Experience managing technical professionals and building high-performing teams.
- Experience in semiconductor wafer probe, RF test systems, or advanced packaging technologies.
- Experience leading global engineering teams and cross-site development activities.
- Understanding of PCB, thin-film, ceramic, advanced substrate technologies.
- Understanding of SMT manufacturing process.
- Experience driving design automation and design productivity improvements.
- Familiarity with Lean Manufacturing, Six Sigma, DOE, SPC, and Gage R&R principles.
Skills: RF probe card, microwave, transmission line, design methodologies, semiconductor test
This role has been open 55 days — slightly above the 51-day median for RF/Wireless Engineering roles.
RF/Wireless Engineering · RF Frontend
|
Open roles in category
265
|
Median days open
51 d
|
Median salary
$162k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | FormFactor | All employers we track in this specialty (265 roles · 34 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 265 |
| Open roles in the wider Analog & Mixed-Signal family | 6 | 1400 · 106 employers |
| Median days open | 55 d | 51 d (+4 d vs this employer) |
| Median salary (USD postings) | — | $162k |
Skills observed across this category: RF probe card, microwave, transmission line, design methodologies, semiconductor test
Who's hiring in this category
- QORVO · 46 open roles · median 35 d
- Skyworks · 41 open roles · median 40 d
- Keysight Technologies · 24 open roles · median 174 d
- Qualcomm · 24 open roles · median 102 d
- Apple · 20 open roles · median 19 d
- Analog Devices · 12 open roles · median 57 d
How we counted: 265 open RF/Wireless Engineering (RF Frontend) roles from 34 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Analog & Mixed-Signal family row. Figures refresh nightly.