Sr. Manager Packaging Engineering - TX, Austin, United States

Originally posted 12 October 2026 by the employer.

About the role

What you'll do

• Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets.
• Drive execution in dynamic environments, managing competing priorities across programs.
• Establish and maintain robust execution frameworks, including milestone tracking, risk management, and readiness gates.
• Interface with senior leadership to provide clear program status, risks, and mitigation strategies.
• Lead, mentor, and grow a high-performing team of package design engineers across geographies.
• Collaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence.

What you'll need

• Experience in semiconductor package design, with strong focus on high-performance or data center products.
• Proven experience leading teams and executing multiple concurrent complex projects.
• Strong understanding of package layout, high-speed design considerations, and multi-die integration.
• Experience working with OSATs, substrate vendors, and manufacturing partners.
• B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field.

Nice to have

• Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).
• Hands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent.
• Experience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration).

Skills: Data Center GPU, MI programs, multi-die integration, 2.5D/3D integration, chiplets