Sr. Equipment Engineer CMP (Mult. Pos.) - Job# 5381 - USA-Arizona, United States
Originally posted 30 June 2026 by the employer.
As a Sr. Equipment Engineer – CMP, you will contribute to the operation of the N4 process technology fab.
About the role
As a Sr. Equipment Engineer – CMP, you will improve tool performance and availability, demonstrating reliability and enthusiasm. You will work with equipment utilizing 5nm or beyond technology in a clean room environment.
What you'll do
- Solve critical equipment issues, improving tool uptime availability and utilization efficiency. - Identify and pursue opportunities for hardware capability enhancement, driving defect reduction. - Drive root causes and corrective action analysis on process escalations. - Install and qualify new tool sets for the 5-nanometer or beyond equipment according to planned schedules and meet the process released standard. - Communicate with cross-function engineers or vendors, and serve as a module liaison with facilities, vendor, and manufacturing shift personnel.
What you'll need
- Master’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 1 year of experience in an engineering role; OR Bachelor’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 3 years of experience in an engineering role. - 1 year of experience with semiconductor manufacturing principles, practices and techniques as they relate to equipment engineering and maintenance. - 1 year of experience in 5nm technology or beyond in logic chip semiconductor industry, including 5nm or more advanced tools maintenance, troubleshooting, and equipment improvement. - Education or experience in data analysis, components and equipment selection, CMP basic principles, and semiconductor manufacturing processes. - Ability to adjust equipment parameters based on process requirements, analyze and diagnose wafer surface defects and material removal rates, and operate specialized CMP equipment control interfaces and operating software with basic operation and maintenance skills for robotic arms. - 1 year of experience in at least 2 of the following software: C++, Python, UNIX, Creo 3D CAD, Pro-E, AutoCAD, MATLAB, COMSOL, OrCAD, or Solidworks.
This role has been open 93 days — well above the 53-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
3642
|
Median days open
53 d
|
Median salary
$128k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | TSMC Arizona | All employers we track in this specialty (3642 roles · 83 employers) |
|---|---|---|
| Open roles in this specialty | 41 | 3642 |
| Open roles in the wider Process, Fab & Equipment family | 92 | 9611 · 109 employers |
| Median days open | 140 d | 53 d (+87 d vs this employer) |
| Median salary (USD postings) | — | $128k |
Who's hiring in this category
- Applied Materials · 603 open roles · median 56 d
- Lam Research · 526 open roles · median 41 d
- Micron Technology · 250 open roles · median 38 d
- KLA Corporation · 249 open roles · median 62 d
- ASML · 187 open roles · median 69 d
- ASM International · 158 open roles · median 72 d
How we counted: 3642 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 83 employers tracked in the SemiconductorJobs index, counted 2 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.